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Here you can find knowledge about PCBA Soldering Material, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
High-voltage and insulation testing in PCBA reliability testing is a critical process on the production line for determining whether a circuit board has potential risks of current leakage, creeping discharge, or dielectric breakdown. By applying a specified voltage and monitoring changes in leakage current, it can effectively identify real production line issues such as PCB lamination defects, solder bridging, flux residue, and insufficient cleanliness, providing a hard safety threshold for the delivery to JJY customers.
Published: 2017-11-27In PCBA reliability testing, vibration testing must accurately reproduce the wide-band, high-acceleration, multi-axis coupled operating conditions in energy storage vehicle environments. Production line tests conducted by JJY show that performing only sinusoidal frequency sweep per the IEC 60068-2-6 standard will miss microcracks in solder joints and BGA cold solder joints. It is necessary to superimpose random vibration spectra and three-axis synchronous excitation to effectively expose structural weak points in PCBA reliability testing.
Published: 2017-09-26The solder for industrial control motherboards is specifically designed for high-reliability soldering of industrial control motherboard PCBA. It features excellent wettability, low void rate, and strong thermal cycle resistance, meeting the demands of harsh scenarios such as wide temperature range, long service life, and vibration resistance. It is a core material for ensuring the long-term stability of solder joints on industrial control motherboards.
Published: 2017-06-01Jiajinyuan PCBA soldering materials are specifically designed for new energy battery management system BMS boards, photovoltaic inverter control boards, and industrial PLC main control boards. Its low-void-rate solder paste maintains a stable void area of less than 12% after reflow in 0.3mm fine-pitch QFN packages, which can be further reduced to 8.5% with a nitrogen atmosphere, meeting the stringent requirements of automotive-grade AEC-Q200 for solder joint reliability.
Published: 2016-12-27The no-clean and water-washable formulations for PCBA soldering materials need to balance ionic residue control and post-soldering surface cleanliness. The Jiajinyuan series formulations achieve stable performance with rosin-based residue <0.5μg/cm2 and halogen content <0.1wt% in actual production lines, meeting the process requirements for high-density PCBA soldering materials for 01005 components and 0.3mm pitch BGA.
Published: 2015-09-05Rework soldering is a critical process in PCBA repair that demands extremely high precision and thermal control. This paper focuses on the full process of desoldering and replacing chips such as BGA and QFN, covering hot air gun parameter setting, stencil aperture matching, solder paste selection, and key points of post-soldering X-ray inspection. All parameters are derived from measured data on the JJY production line, emphasizing the coordinated control of temperature curve gradients, nozzle vacuum values, and PCB delamination risks.
Published: 2015-07-12Reliability testing of PCBA for medical communication applications must comply with stringent standards such as IEC 60601-1 and AAMI TIR18. Its PCBA reliability test items cover temperature cycling, highly accelerated life testing, vibration and shock, and damp heat with bias. For each test, stress parameters must be set based on real production line failure data. Production line measurements by Jia Jinyuan show that for BGA solder joints, a cracking rate exceeding 3% after 500 temperature cycles from -40°C to +85°C is deemed a process red line.
Published: 2015-06-27Dip soldering is a core process for high-volume PCBA pin soldering. The composition, melting point, and oxidation control of wave soldering solder bars directly determine solder joint wettability and cold solder joint rate. Jia Jinyuan wave soldering solder bars can maintain a solder wave height deviation of ≤0.3 mm and a solder dross generation rate of less than 1.2% during 8 consecutive hours of production, significantly reducing fixture rework frequency.
Published: 2011-07-29To address the challenge of cleaning residual stains on solder paste boards, it is necessary to simultaneously optimize solder paste selection and process parameters. While no-clean solder paste reduces cleaning pressure, it is more sensitive to stencil apertures and reflow environments. In contrast, traditional solder paste paired with cleaning requires chemical compatibility between the cleaning agent and solder paste residues. The cleaning effectiveness of solder paste is directly influenced by its metal content, rosin system, and activator type.
Published: 2011-04-17Consumer electronics solders must balance low melting point, high wettability, and low corrosivity of residues. Especially in high-density PCBA soldering for mobile phone earphones and similar devices, Jia Jinyuan SN96.5AG3.0CU0.5 solder has been experimentally measured to have a wetting angle of <25° on 0.3mm pitch BGA and 0201 components, with the post-reflow ICT test defect rate stably controlled within 80ppm.
Published: 2011-01-18Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.