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Here you can find knowledge about No-Clean Solder Paste, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
In actual production lines, solder auxiliary materials must be flexibly selected between no-clean or water-washing processes according to the reliability requirements of end products. The Jiajinyuan series of solder auxiliary materials achieve adaptation to the dual demands of fast-paced consumer electronics production and high cleanliness standards for automotive electronics without equipment replacement by adjusting rosin content, activator ratio, and solvent boiling point distribution.
Published: 2020-10-18
Whether flux paste must be cleaned after SMT soldering depends on the chemical activity and ion content of the flux residue, as well as the requirements of subsequent assembly processes. No-clean flux paste is not completely residue-free; rather, its flux residue becomes inert and low-corrosive after reflow. However, high-density BGA or aerospace-grade products still require cleaning to mitigate the risk of long-term electrochemical migration.
Published: 2019-12-31Based on real cases from SMT production lines, this paper details the verification methods for the insulation performance of the no-clean solder paste process, covering three core solder paste testing methods: ionic contamination testing, surface insulation resistance (SIR) testing, and post-reflow ICT open-circuit retesting. It emphasizes the direct impact of no-clean solder paste residues on the risk of leakage between micro-pitch solder joints under BGA packages.
Published: 2018-07-14Addressing the practical selection pain points of SMT production lines, this section breaks down the solder paste selection logic from three dimensions: printability, reflow performance, and cleaning compatibility. It clarifies that water-washable solder paste must match the spray pressure and solvent concentration of the cleaning machine, while no-clean solder paste must pass the ionic contamination test and its residues must not corrode gold fingers. The performance differences of different solder pastes under stencil aperture, squeegee angle, and ambient temperature and humidity directly determine the first-pass yield.
Published: 2017-10-15The no-clean and water-washable formulations for PCBA soldering materials need to balance ionic residue control and post-soldering surface cleanliness. The Jiajinyuan series formulations achieve stable performance with rosin-based residue <0.5μg/cm2 and halogen content <0.1wt% in actual production lines, meeting the process requirements for high-density PCBA soldering materials for 01005 components and 0.3mm pitch BGA.
Published: 2015-09-05To address the challenge of cleaning residual stains on solder paste boards, it is necessary to simultaneously optimize solder paste selection and process parameters. While no-clean solder paste reduces cleaning pressure, it is more sensitive to stencil apertures and reflow environments. In contrast, traditional solder paste paired with cleaning requires chemical compatibility between the cleaning agent and solder paste residues. The cleaning effectiveness of solder paste is directly influenced by its metal content, rosin system, and activator type.
Published: 2011-04-17Based on production line measurements, this paper compares the performance of domestic no-clean solder paste in terms of QNP solder wetting rate, halogen residue, void control, and printing stability. It focuses on analyzing the process adaptability of three JIAJINYUAN SMT solder pastes—8MQP/5RQ, 8MNTTP/5RNTT, and 8M9P/5RR—on high-precision communication boards and automotive lighting boards, providing reproducible parameter references for the selection of domestic solder paste.
Published: 2009-06-02Low-residue solder paste and no-clean solder paste are becoming key choices for cost reduction and efficiency improvement in high-density PCBA production lines. Domestic solder paste has already demonstrated the capability to replace imported alternatives in terms of halogen control, solder climbing performance, and thermal stability. The Jiajinyuan 8MNTTP/5RNTT series achieves ultra-low halogen levels of 100~200ppm with transparent residue, while the 8M9P/5RR series reaches 0ppm zero halogen with extremely low voidage, making it suitable for high thermal reliability scenarios such as automotive lighting.
Published: 2009-04-15The choice between no-clean solder paste and water-washable solder paste must be closely aligned with the actual production line conditions. For example, when QFN solder wetting requirements are close to 100%, the 8MQP/5RQ series should be prioritized. For low-voidage scenarios such as automotive lighting, halogen-free 8M9P/5RR must be used. Water-washable solder pastes like 8MW1P/5RW1 are suitable for cost-sensitive production lines equipped with cleaning equipment. Domestic solder pastes now cover the full spectrum from ultra-low-temperature In52Sn48 to laser-specific 5RLJ. The key lies in matching the process window with reliability requirements.
Published: 2009-01-15Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.