After switching the production line to domestic low-residue Solder Paste, the printing yield has stabilized from 92.7% to 99.1%. The key is that the 8MNTTP/5RNTT series maintains a long-term solder wetting coverage rate of over 95% for QFN 0.4mm pitch. Its 00507BN and 00507B2N alloy powders, combined with ROL0-level halogen control (100~200ppm), not only meet the high cleanliness requirements of fingerprint lock motherboards but also avoid functional test misjudgments caused by ionic contamination.

The 8M9P/5RR zero-halogen solder paste performs excellently in the reflow soldering of automotive headlight modules. The measured average solder joint void rate is below 1.3%, far better than the 3.8% of conventional high-temperature solder paste. This is because its 0ppm halogen and SC07/305 dual alloy powders synergistically optimize the melting fluidity. Meanwhile, the residue is transparent with an insulation resistance >1×10¹¹Ω, completely eliminating the need for a cleaning process and saving approximately 2.4kW·h of energy consumption for the water washer per shift.

For the soldering of thermal pads on communication base station PA modules, it has been verified that 8MTSP/5RTS can maintain Flux activity under the conditions of a soaking zone at 210℃ for 90s. Its residue is as transparent as glass with a thickness <0.8μm, and there are no false defect alarms in AOI inspection. Under the same process, a certain imported brand showed a 3.2% false solder missed detection rate. The root cause is that its rosin matrix has a high thermal decomposition temperature, leading to insufficient interfacial wetting.

The selection for laser jet soldering must match T6/T7 fine powders. The 5RLJ series uses 00507BN+T6 powder to achieve a solder joint diameter CV value <4.7% under a 200W fiber laser, with no solder balls and a thrust >4.2N. However, if T4 powder is mistakenly used, the nozzle clogging frequency increases by 3 times. This shows that although the process window of domestic no-clean solder paste is wide, it still requires strict matching of equipment parameters and alloy powder particle size distribution.

After the lighting LED production line switched to the 8MA series, the white fog phenomenon on the board surface after reflow disappeared. Its ROL1-level halogen (<900ppm) combined with 0307/T3 powder increased the solder joint gloss by 22%, and the reflow temperature range was broadened from 235~255℃ to 230~260℃. The improved compatibility directly reduces the line change and parameter adjustment time. Although the water-washable 8MW1P/5RW1 has low cost, it easily causes oxidative blackening of the board surface after cleaning in high-humidity environments, and is only suitable for non-precision scenarios such as single-layer aluminum substrates.