Starting January 1, 2026, the General Technical Requirements for SMT Solder (SJ/T 11827-2023), revised under the leadership of the China Electronics Standardization Institute of the Ministry of Industry and Information Technology, has been officially implemented nationwide. This standard achieves two-way alignment with the International Electrotechnical Commission's IEC 61190-1-1:2022 across 12 core indicators, including alloy composition tolerances, halogen content limits, and post-soldering surface insulation resistance. This marks the first time China's SMT solder technical standard system has completed substantive alignment with mainstream international standards, rather than simply adopting equivalent adoption.

At the first SMT supply chain collaboration conference of 2026 held in Suzhou Industrial Park, technical quality leaders from Luxshare Precision, Shennan Circuits, Foxconn Zhengzhou Park, and Nitto Denko Electronics jointly confirmed that Solder Paste batches based on the new standard have completed three consecutive months of cross-validation across 8 high-reliability automotive electronics production lines in four locations. The average fluctuation of solder joint void rate is controlled within ±0.8%, the reflow profile adaptation window has been widened by 12 seconds compared to the old standard, and production line changeover response time has been shortened by approximately 2.3 hours, reflecting that the improved process robustness brought by standard unification has measurable practical outcomes.

It is worth noting that the implementation of this standard was not led by a single leading enterprise, but rather relied on the SMT Solder Working Group of the China Electronic Materials Industry Association, forming a closed-loop feedback mechanism jointly established by 32 material suppliers, 17 equipment manufacturers, and 24 EMS service providers. Between 2024 and 2025, a total of 147 valid process deviation cases were submitted, of which 61% involved differences in OSP compatibility judgment for the same lead-free solder among customers in different regions, directly contributing to the addition of an appendix clause on "graded evaluation of copper substrate adaptability" in the new standard.

Spot trading data from Shenzhen Huaqiangbei Electronic Components Distribution Center shows that in the first quarter of 2026, the number of SMT solder SKUs labeled as compliant with SJ/T 11827-2023 increased by 41% year-on-year, while the average price only rose slightly by 1.6%, indicating that upstream material manufacturers have diluted compliance costs through large-scale formula management and testing process reuse. Meanwhile, the average procurement decision cycle for downstream small and medium-sized EMS enterprises has been shortened by 5.7 working days, confirming that standard unification is accelerating penetration from the institutional level to the supply chain execution end.

Currently, uncovered divergence points are concentrated on the thermal fatigue life evaluation method for low-temperature solder. There are still differences in accelerated test stress loading paths between Japanese JIS Z 3198 and the new national standard. This issue has been listed as a priority agenda item for the IEC/TC91 2026 Autumn Working Group Meeting. Major domestic Solder Manufacturers have simultaneously launched joint aging tests in three locations, with data collection covering three typical temperature and humidity gradient environments in Guangzhou, Wuhan, and Xi'an, providing measured support for the next stage of standard evolution.