SMT Solder Paste Manufacturers.
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Here you can find knowledge about Solder Paste Production, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
When soldering BGA devices on thick copper boards, due to the large heat capacity and slow heating rate, the flux in the solder paste does not volatilize sufficiently and gas escape is hindered, making it extremely easy to form void defects inside solder joints. It is necessary to select a special solder paste with low residue, high activity, and a wide reflow window; otherwise, the void rate generally exceeds 25%, far exceeding the requirement of ≤15% for IPC-A-610 Class G.
Published: 2020-12-08Solder paste is accelerating its replacement of traditional leaded/lead-free systems in low-temperature soldering scenarios. Among them, Sn-Bi solder paste has become the preferred choice for flexible circuits, temperature-sensitive devices, and mixed assembly of dissimilar materials due to its 138°C eutectic point. However, its inherent brittleness and insufficient thermal fatigue resistance lead to frequent solder joint cracking, especially under the combined stress of temperature cycling and mechanical vibration, where its reliability shortcomings become prominent. Engineers need to simultaneously evaluate the device package type, PCB copper thickness distribution, and matching degree of reflow profile slope during selection.
Published: 2020-12-08Selective wave soldering bar selection must balance melting point stability, surface tension, and oxide film formation rate; solder dross control is directly affected by solder bar purity, copper and iron impurity content, and flux compatibility. The Jiajinyuan SN99.3CU0.7 series has a measured dross rate below 1.2% in small and medium batch high-density board soldering, significantly outperforming conventional solder bars.
Published: 2020-11-14
When choosing between syringe-packaged and bottled solder paste for mobile phone repair, the key factors are work precision, reapplication frequency, and solder ball control capability. Syringe packaging delivers stable paste output in high-precision electronic repair scenarios such as BGA ball mounting and flying wire soldering, and is less likely to contaminate PCBs. Bottled solder paste, while lower in cost, is prone to oxidation and introduces more impurities during dipping, which in turn increases the rate of cold solder joints and rework over long-term use.
Published: 2020-11-10In actual production lines, solder auxiliary materials must be flexibly selected between no-clean or water-washing processes according to the reliability requirements of end products. The Jiajinyuan series of solder auxiliary materials achieve adaptation to the dual demands of fast-paced consumer electronics production and high cleanliness standards for automotive electronics without equipment replacement by adjusting rosin content, activator ratio, and solvent boiling point distribution.
Published: 2020-10-18Insufficient flux activity in solder paste will significantly weaken its ability to remove oxide films, leading to poor pad wetting after solder paste printing and insufficient solder spreading during reflow, which ultimately causes cold solder joints in the solder paste. This issue is particularly prominent in 0201/01005 micro components, OSP surface-treated PCBs, and low-temperature reflow processes, requiring coordinated verification from three aspects: flux acid value, halogen content, and activation temperature window.
Published: 2020-09-21The SGS solder factory can provide copies of inspection certificates along with the goods, significantly shortening the incoming material acceptance cycle for JJY's production lines and delaying SMT scheduling caused by waiting for third-party reports. All SGS solder batches correspond to a unique factory number, and the certificates cover tin content, impurity elements, melting point range, and measured wettability data, fully meeting the compliance requirements for solder alloys specified in IPC-J-STD-006C.
Published: 2020-09-12The selection and control of solder materials in electronics manufacturing directly determine the first-pass yield of PCBA. The metal content, viscosity, and slump resistance of solder paste must match the stencil apertures, reflow profile, and component density of the production line. Jia Jinyuan solder paste performs excellently in 0.3mm pitch QFN printing, while solder wire and solder bar require focused monitoring of rosin residue and wetting angle consistency.
Published: 2020-08-29
The presence of honeycomb pores on the surface of tin bars is not necessarily a quality defect, and comprehensive judgment should be made in combination with the appearance of solder, smelting process and application scenarios. For example, for tin bars smelted and cast in a low-oxygen environment, if there are only tiny honeycomb pores on the surface layer that do not affect wettability and drawing continuity, they are within the acceptable range. However, honeycomb pores accompanied by oxidation slag, wire breakage or poor tin plating clearly indicate that the internal purity of the tin bar or the degassing process is out of control.
Published: 2020-08-17BGA soldering in 5G communication and energy storage motherboards faces challenges of high thermal stress, long-term aging, and high-frequency signal integrity. By optimizing stencil aperture design, segmented temperature control of reflow profile, and post-soldering full X-ray inspection process, JJY ensures that BGA solder joints have no void expansion and no abnormal IMC thickening after 1000 hours of accelerated aging at 85℃/85%RH, achieving true long-term reliability.
Published: 2020-08-15Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.