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Here you can find knowledge about Reflow Solder Paste, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
The reflow oven temperature profiling board must be calibrated with a standard thermocouple once before each shift starts. If the deviation exceeds ±1.5°C, the line must be shut down immediately for adjustment; otherwise, the actual temperature profile will deviate from the set values, leading to frequent BGA cold solder joints, tombstoning, or solder balls. This is the core control point for Jia Jinyuan's production line achieving zero batch rework for three consecutive years.
Published: 2010-09-15Cold solder joint is a fatal defect common to wave soldering and SMT reflow soldering, with causes spanning multiple stages such as solder paste printing misalignment, oven temperature profile mismatch, PCB pad oxidation, insufficient flux activity, and conveyor speed fluctuations. Jia Jinyuan production line data shows that over 65% of soldering defects caused by cold solder joints stem from insufficient preheating and deteriorated interfacial wetting when nitrogen purity is below 99.99%.
Published: 2009-11-12This paper focuses on the actual selection logic of high-temperature solder paste among domestic solder paste brands, combining 12 series of parameters verified by first-tier production lines such as Jia Jinyuan, covering QFN solder wetting rate, halogen content, alloy powder type, and the reflow soldering temperature window for solder paste. It particularly emphasizes the stability performance of 0307/305 alloys under the 240–260℃ reflow soldering process for solder paste.
Published: 2009-05-27For the frequently occurring solder bead defects on SMT production lines, starting from three aspects: stencil aperture optimization, adjustment of solder paste metal content and particle size distribution, and coordinated control of reflow soldering ramp rate and peak temperature, a directly implementable solder bead improvement plan is proposed, emphasizing the balance between solder paste printing ductility and splash suppression during reflow.
Published: 2009-05-26Multiple factories have tested and confirmed that domestic solder paste performs stably in reflow soldering applications. The 8MQP/5RQ series achieves a solder climbing rate close to 100%, the 8MNTTP/5RNTT series has a halogen content as low as 100~200ppm, and the 8M9P/5RR series delivers 0ppm zero halogen and extremely low voidage. These products cover scenarios including QFN/DFN, automotive lighting, high-precision communications, and ultra-low temperature laser welding. Domestic SMT solder paste replacement now has full temperature range and full process adaptability.
Published: 2009-05-19The practical performance of high-activity solder paste in achieving nearly 100% solder wetting rate for fine-pitch QFN/DFN devices directly determines the success or failure of domestic solder paste brand selection. Based on the measured data of Jia Jinyuan LFP-JJY series halogen-free and lead-free high-temperature solder paste, this paper compares the differences in residue transparency, halogen content, and alloy powder particle size distribution among models including 8MQP/5RQ, 8MTSP/5RTS, and 8MNTTP/5RNTT in the reflow soldering solder paste process, providing a directly applicable domestic solder paste replacement solution for SMT production lines.
Published: 2009-03-30Solder paste spattering during reflow soldering is mostly caused by printing misalignment, unreasonable stencil aperture design, excessive squeegee pressure, or sudden changes in solder paste viscosity. Selecting anti-spattering solder paste with high thixotropy and low spattering tendency can significantly improve the issue. Domestic solder pastes such as Jiajinyuan LFP-JJY5RNTT-0307 (halogen 100~200ppm) and LFP-JJY5RR-0307 (halogen-free) deliver stable performance in QFN solder wetting rate and void control, making them a cost-effective alternative to imported reflow soldering solder pastes.
Published: 2009-03-26Tombstoning defects in SMT production lines are mostly caused by the combined effect of uneven solder paste volume and uncontrolled reflow ramp-up rate. By precisely controlling the consistency of solder paste printing thickness, adjusting stencil aperture sizes to match the pads, and stabilizing the ramp-up rate in the reflow preheating zone within the range of 1.2℃/s to 1.8℃/s, the incidence of tombstoning in 0402 to 0603 packaged chip components can be significantly reduced.
Published: 2009-02-17Post-welding insulation impedance compliance depends on the ionic cleanliness of solder paste residues and the compactness of the formed film. Domestic high-insulation solder pastes, through strict halogen control (ROL0 grade <500ppm), optimized rosin matrix and T4/T5 fine powder ratio, achieve 70%~100% solder wetting rate for QFN/DFN while ensuring the impedance between reflow solder paste joints is >10^9Ω. Series including LFP-JJY5RNTT, 5RR and 5RLJ have been mass-applied in communication module and automotive LED production lines.
Published: 2009-01-19Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.