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Here you can find knowledge about Reflow Solder Paste, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
Cleaning the furnace chamber during daily maintenance of reflow ovens is a key measure to prevent carbonized flux residue from contaminating PCB surfaces. Operations must account for the softening characteristics of residues under a nitrogen atmosphere, the matching degree between chain speed and temperature zone settings, and the unique furnace chamber structural design of Jiajinyuan reflow ovens, to avoid carbon buildup in high-temperature zones that could cause continuous surface yellowing or solder bead defects.
Published: 2019-08-11The process window setting for lead-free solder paste reflow soldering must balance the coordinated control of peak temperature and soaking zone. Jia Jinyuan lead-free solder paste performs stably in the peak temperature range of 235°C to 245°C. However, if the soaking zone temperature is below 150°C and the duration is less than 60 seconds, it can easily lead to poor wetting and increased void rate. In actual production lines, the conveyor speed and the power of each temperature zone need to be dynamically adjusted based on the measured curves from a temperature profiler.
Published: 2018-06-18In the entire chip soldering process, the precision of solder paste printing via SMT stencil directly determines the yield of subsequent component placement and reflow soldering. The viscosity, particle size, and metal content of the solder paste, as well as printing parameters such as squeegee pressure, speed, and release distance, must be coordinated and matched with the actual conditions of the production line. Any mismatch will cause typical defects such as insufficient solder, solder bridging, and misalignment.
Published: 2017-09-07During the soldering process of OSP boards, pad oxidation is the main cause of cold solder joints and poor wetting. Reasonably setting the reflow profile can effectively suppress copper surface oxidation, with the key being to control the heating rate, shorten the high-temperature exposure time, and ensure the peak temperature accurately falls within the 195℃~210℃ range. Production line verification by Jiajinyuan shows that when the TAL time exceeds 60 seconds or the peak temperature exceeds 212℃, the decomposition of the OSP film accelerates, and the risk of pad oxidation increases sharply.
Published: 2017-08-04Solder ball issues are mostly caused by excessive solder paste volume, unreasonable stencil aperture design, or excessively fast ramp-up rate during reflow soldering, and these three factors often interact in actual production lines. For Jiajinyuan solder paste, when the stencil thickness is 0.12mm, if the aperture area ratio exceeds 0.65 and the ramp-up slope before the peak temperature exceeds 3℃/s, isolated solder balls with a diameter of 40–80μm are extremely likely to form at the edges of CHIP component pads.
Published: 2017-07-31Nitrogen reflow is a key method for improving soldering reliability in high-end SMT processes, but higher nitrogen concentration is not always better. Actual measurements on Jia Jinyuan's production lines show that within the 99.5% to 99.9% range, every 0.1 percentage point increase raises nitrogen consumption costs by 8%, while the improvement in solder joint void rate slows down. The target value must be dynamically set based on PCB thickness, BGA solder ball size, and solder paste activity grade.
Published: 2016-08-20Adjusting solder paste process parameters under a nitrogen reflow environment can significantly reduce the solder paste void rate. It is necessary to simultaneously optimize the heating slope, peak temperature and atmospheric oxygen content of reflow soldering, and combine stencil aperture design with squeegee pressure to control printing accuracy, so as to avoid cold solder joints and poor wetting caused by uneven nitrogen displacement or hindered flux volatilization.
Published: 2016-08-11AOI inspection after SMT reflow soldering can efficiently identify appearance soldering defects such as solder joint bridging, tombstoning, solder beads, and misalignment, greatly reducing the missed inspection rate of manual visual inspection. With a pixel accuracy of 0.015mm and the capability of multi-angle light source switching, Jia Jinyuan's AOI inspection equipment stably controls the false alarm rate within 1.2% for solder joint judgment of components below 0603.
Published: 2016-07-14Daily routine inspection of reflow soldering production lines is the core line of defense against batch defects. Through systematic checks of rail parallelism, nitrogen purity, deviations between actual and set temperatures in each temperature zone, chain speed stability, and cooling section wind speed every shift, over 90% of typical defects such as cold solder joints, tombstoning, and cold soldering can be intercepted in advance, avoiding batch rework caused by single-point failures.
Published: 2016-03-28Excessively high peak reflow temperature of solder paste will directly lead to excessive growth of intermetallic compounds in solder paste joints, intensified dissolution of pad copper, and thermal damage to component bodies. In actual production lines, common defects include cold solder joints, solder balls, tombstoning, and PCB delamination. This problem mostly stems from inaccurate temperature profile settings, drift of furnace temperature sensors, or uncalibrated differences in activity between different batches of solder paste.
Published: 2015-12-10Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.