Anti-Collapse Solder Paste

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Anti-Collapse Solder Paste
Home Anti-Collapse Solder Paste Anti-Collapse Solder Paste for Printing Processes, Preventing Edge Collapse SMT Solder Paste

Anti-Collapse Solder Paste for Printing Processes, Preventing Edge Collapse SMT Solder Paste

Anti-Collapse Solder Paste Knowledge

Here you can find knowledge about Anti-Collapse Solder Paste, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.

High-Stability No-Clean Solder Paste, Compatible with 01005 Micro Components, with Improved Printing Anti-Collapse Performance

High-Stability No-Clean Solder Paste, Compatible with 01005 Micro Components, with Improved Printing Anti-Collapse Performance

Jiajinyuan has launched a high-stability no-clean solder paste, specifically designed for 01005 micro components. By optimizing the alloy powder particle size distribution (T4/T5), rosin-based flux system, and rheological property control, it significantly improves printing anti-slump performance while maintaining halogen-free and lead-free high-temperature characteristics, meeting the high solder climbing rate requirements for QFN/DFN.

Published: 2022-12-14

Ball Mounting Process Adopts T5/T6 Ultra-fine Solder Paste for Uniform Forming and Excellent Anti-collapse Performance

The use of T5/T6 ultra-fine solder paste in the ball mounting process can significantly improve the consistency of solder ball formation and edge retention, addressing issues such as easy edge collapse, poor sphericity, and height dispersion commonly associated with traditional solder pastes. It is particularly suitable for micro-pitch BGA ball mounting below 0.3mm and high-density packaging scenarios.

Published: 2015-12-17

Recommendations for Domestic Anti-Collapse Solder Paste for Fine-Pitch Components

To address the common issue of solder collapse during the soldering of fine-pitch components such as 0.4mm pitch QFN and 0.3mm CSP, we recommend a range of field-tested anti-collapse solder pastes that cater to specific requirements including zero halogen, low voiding, and high solder climb. Among them, the 8MNTTP/5RNTT series achieves a solder climb rate of over 98% with transparent residue during reflow soldering on mobile phone motherboards, while the 8M9P/5RR series delivers a void rate of less than 3% on automotive LED lighting boards. All products use T4/T5 grade fine-pitch alloy powder and rosin-based flux vehicles, making them truly triple-positioned products that are anti-collapse solder pastes, fine-pitch solder pastes, and domestic solder pastes suitable for domestic production lines.

Published: 2009-05-07
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