Excessive storage temperature of Solder Paste will cause oxidation of solder particles, affect fluidity, and lead to soldering defects.

Too low temperature may cause stratification of Flux components, reduce wettability, and lead to cold solder joints.

If clumping or discoloration is found in the solder paste, stop using it immediately and inspect the storage environment.

Solder paste must be used up within the specified time after opening; solder paste beyond its expiration date must not be used for critical parts.

It is recommended to store solder paste in an environment of 5 to 25 degrees Celsius, avoiding direct sunlight and high-temperature areas.

Before each use of solder paste, confirm whether it is within the expiration date and check for any abnormalities.

A constant temperature should also be maintained during transportation to prevent sudden temperature changes from affecting the solder paste.

If the solder paste has not been used for a long time, it needs to be stirred regularly to restore its uniformity.

Process personnel should establish a clear solder paste management system to ensure that every step complies with standards.

When purchasing, suppliers with good storage records should be selected to ensure controllable solder paste quality.