LFP-2R-64351 halogen-free and lead-free medium-low temperature Solder Paste is a product developed by JiajinYuan for the assembly scenarios of temperature-sensitive devices. Its melting point falls in the medium-low temperature alloy range, and the peak reflow temperature can be as low as 180°C to 200°C, which can effectively reduce the thermal stress of PCBs and components.

This product adopts the SnBi alloy system as the base, paired with a halogen-free Flux. The halogen residue after soldering is zero, meeting the requirements of RoHS and REACH environmental protection regulations. The medium-low temperature soldering process can avoid the glass transition of FR-4 boards, reduce PCB warpage and deformation, and improve the soldering reliability of large devices such as BGAs.

In terms of the printing process, the LFP-2R series solder paste has excellent thixotropy and anti-sagging performance, suitable for printing fine-pitch components with a pitch of 0.3mm to 0.65mm. The solder paste has good viscosity stability and a long stencil life, which can meet the process requirements of long-time continuous production.

This product has been widely verified in SMT assembly of temperature-sensitive devices such as LED displays, camera modules, and temperature-compensated crystal oscillators. It has excellent soldering yield and product reliability, making it an ideal choice for medium-low temperature Reflow Soldering processes.