The LFP-5RW1 series water-washable lead-free Solder Paste includes two products: the LFP-5RW1-0307 high-temperature type and the LFP-5RW1A-4258 low-temperature type. It adopts a water-soluble Flux system, and residues can be completely removed with pure water or weakly alkaline water-based cleaning agents after soldering, making it the preferred material for high-cleanliness electronic assembly.

The core advantage of water-washable solder paste lies in its controllable post-soldering cleanliness. Although traditional no-clean solder paste does not require cleaning, flux residues will remain attached to the PCB surface for a long time, which may trigger electrochemical migration risks in high-humidity and high-salt-spray environments. The LFP-5RW1 series completely removes residues through water-washing processes, meeting the cleanliness requirements of high-reliability scenarios such as automotive electronics, aerospace electronics, and industrial control.

The product adopts a composite system of organic acids and surfactants in its flux formulation, with good activation performance that can remove oxide layers on pads and component terminations. Post-soldering residues are easily soluble in water and can be removed by washing at room temperature; cleaning with warm water at 40°C to 60°C yields better results.

The melting point of the LFP-5RW1A-4258 low-temperature type falls within the low-temperature alloy range. Combined with water-washing processes, it achieves the dual goals of low-temperature soldering and high cleanliness, making it suitable for post-stage assembly of PCBA that already has temperature-sensitive components mounted.