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Here you can find knowledge about Soldering Auxiliary Materials, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
Solderability of immersion silver (ImAg) PCBs poses dual challenges to solder paste in terms of wetting performance and corrosion resistance. Jiajinyuan GJ-812A solder paste demonstrates excellent compatibility with silver finishes in actual production lines. Its weakly acidic flux system ensures sufficient wetting for 0.3mm fine-pitch QFN packages while avoiding excessive corrosion of the immersion silver layer. After reflow, the solder joints exhibit a clean surface and uniform IMC layer, effectively reducing the risks of cold solder joints and black pad.
Published: 2024-03-12During the rework soldering and BGA chip ball mounting process, an excessive void rate is the main cause of cold solder joints, increased thermal resistance, and early failures. Using low-void solder paste can significantly improve the metallurgical bonding quality of solder joints, and especially maintain structural integrity after multiple thermal cycles. In actual tests, the Jiajinyuan JGY-850 series solder paste stably controls the void rate within 8%. Combined with precise stencil aperture design and nitrogen-protected reflow, it increases the first-pass yield of rework soldering to 98.3%.
Published: 2024-02-28
Excessive flux paste application is a high-frequency cause of component displacement in SMT production lines, and this issue is particularly prominent when soldering tiny components such as 0201 and 0402 packages. Based on 20 years of on-site production line measurement experience of JJY, this paper focuses on the coordinated adjustment of three key factors: squeegee pressure, stencil aperture design, and printing speed. It proposes an immediately executable parameter window calibration method to directly target the process balance point between flux paste and component soldering stability.
Published: 2024-02-11
Lead-free solder paste and leaded solder paste have essential differences in composition, melting point, wettability, and reflow profile settings. The key to distinguishing them lies in the RoHS marking on the solder paste batch label, the color of flux residue, and the glossiness of solder joints. Since lead-free solder has a high melting point and high surface tension, it is necessary to increase the peak temperature and extend the time above the liquidus, while imposing higher requirements on stencil aperture design, squeegee pressure, and printing speed.
Published: 2024-01-23Excessive ion contamination from solder paste soldering directly affects PCBA reliability. It is necessary to control it from the source of solder paste selection, giving priority to low-residue, high-purity no-clean solder paste, and cooperating with standardized solder paste testing procedures to ensure that key indicators such as chloride ions and sodium ions meet the requirements of IPC-J-STD-004B Class L0.
Published: 2023-12-17Debugging the BGA soldering reflow curve requires precise matching of the solder paste activity window and solder ball melting characteristics. By optimizing the preheating slope, extending the soaking time, and controlling the peak temperature plateau width, the void rate can be significantly reduced. Test data from JJY shows that the void area ratio was reduced from 18.7% to below 6.2%.
Published: 2023-10-22The vacuum reflow process for solder paste imposes higher requirements on the metal content, flux activity, residue insulation, and high-temperature stability of the solder paste. Vacuum solder paste must feature low volatile content, high wetting power, and anti-slump properties; otherwise, it can easily cause persistent production-line issues such as excessive void rate, cold solder joints, or solder ball splashing. The reliability of solder paste soldering is directly constrained by the suitability of its selection and matching.
Published: 2023-10-05During FPC soldering, using low-temperature solder paste and solder wire can significantly reduce the thermal stress on the substrate, avoiding thermal damage phenomena such as coverlay wrinkling, copper foil peeling, and PI layer discoloration. It is especially suitable for high-density, multi-layer stacked flexible printed circuit boards with IC bonding. Jiajinyuan low-temperature solder paste starts melting at 138℃, with the peak temperature controlled below 210℃. Combined with nitrogen protection, it can further suppress oxidation and improve wettability.
Published: 2023-09-03
The size of the rosin-core hollow in solder wire directly affects the flux release amount, wetting speed and residue distribution. An excessively large hollow easily causes solder spatter, cold solder joints and rosin overflow that contaminates the PCB, while an excessively small hollow leads to insufficient flux, poor wetting and solder joint spikes. In actual production lines, 0.5mm diameter solder wire paired with a 0.12mm rosin-core hollow is the optimal combination for SMT manual touch-up soldering and rework.
Published: 2023-08-25The solder manufacturer provides full-cycle support for wave soldering processes on SMT production lines, covering solder bar selection, wave parameter matching, dross control, and root cause analysis of solder bridges and missed soldering. Jiajinyuan solder manufacturer, through on-site stationed debugging and dynamic monitoring of molten solder metal composition, helps customers increase the first-pass yield of wave soldering from 89.3% to 99.1%, significantly reducing manual rework hours and cold solder joint repair costs.
Published: 2023-07-25Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.