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To address pain points such as prolonged printing without drying, solder paste slump, and poor solder wetting on SMT production lines, this domestically produced solder paste uses a rosin-based formula combined with 0307/T4 alloy powder. Within a reflow window of 240–255℃, it achieves nearly 100% solder wetting rate for QFN/DFN packages, with a halogen content below 900ppm and transparent residue. It balances printing stability and soldering reliability, making it a cost-effective choice as an alternative to imported printing solder paste, SMT solder paste, and domestic solder paste.
Published: 2009-05-23To address the challenge of solder bead control in SMT mass production, we recommend multiple domestic solder pastes validated on production lines, covering scenarios such as high-activity QFN solder climbing, halogen-free automotive lighting, laser welding, and water washing. By optimizing the alloy powder type, halogen content, and rosin system synergy, the probability of solder bead formation is reduced, meeting the triple demands of solder bead control, SMT solder paste stability, and domestic solder paste substitution and upgrading.
Published: 2009-05-21Multiple factories have tested and confirmed that domestic solder paste performs stably in reflow soldering applications. The 8MQP/5RQ series achieves a solder climbing rate close to 100%, the 8MNTTP/5RNTT series has a halogen content as low as 100~200ppm, and the 8M9P/5RR series delivers 0ppm zero halogen and extremely low voidage. These products cover scenarios including QFN/DFN, automotive lighting, high-precision communications, and ultra-low temperature laser welding. Domestic SMT solder paste replacement now has full temperature range and full process adaptability.
Published: 2009-05-19The selection of solder paste for power boards must balance solder climbing capability, void rate, and halogen residue. Domestic solder pastes such as the 8MQP/5RQ series achieve nearly 100% solder climbing on QFN/DFN devices, while the 8M9P/5RR series is halogen-free with an extremely low void rate. The T4-grade 0307 alloy powder used in SMT solder paste forms stably within the 240–260°C reflow window. Domestic solder pastes now cover application scenarios ranging from communication motherboards to automotive lighting.
Published: 2009-05-15Solder paste samples must closely align with actual production line requirements. Domestic solder pastes already have replacement capability in terms of QFN solder wetting rate, halogen control, void rate, and laser welding adaptability. The 8MQP/5RQ series achieves nearly 100% solder wetting, the 8M9P/5RR series delivers zero halogen and extremely low void rate, and the 5RLJ series is specifically optimized for jet valve dispensing. SMT solder paste selection should use process window matching, residue transparency, and post-soldering cleaning cost as hard indicators.
Published: 2009-05-11Continuous printing solder paste directly affects yield and line changeover efficiency in SMT production lines. Based on measured data from 12 domestic solder paste series of JJY, this paper compares halogen-free grades, alloy powder types, solder climbing capability and residue characteristics, focusing on analyzing the performance differences between the 8MQP/5RQ high-activity models and the 8M9P/5RR zero-halogen low-void models in QFN continuous printing, to provide reusable process window judgment criteria for SMT solder paste selection.
Published: 2009-05-05For high-volume SMT production lines, the quality stability of domestic solder paste directly determines the first pass yield and rework cost. The 8MQP/5RQ series achieves nearly 100% solder wetting rate for QFN packages, with both halogen indicators below 1500ppm; the 8M9P/5RR series is halogen-free with an extremely low void rate, making it suitable for high-heat scenarios such as automotive lighting. These mass-produced solder pastes have been validated at multiple leading EMS manufacturers for over 6 consecutive months with no batch-related failures. Solder paste selection for SMT must match the reflow profile window and device pad design. Domestic solder paste has evolved from being usable to being reliable.
Published: 2009-05-03For production lines with tight budgets but non-negotiable welding quality, Jiajinyuan's domestic solder paste centers on its halogen-free, lead-free high-temperature series, covering scenarios such as high solder climbing for QFN/DFN, precision welding of communication equipment, and low voiding for automotive lamps. It offers economical solder paste with T3/T4 grade 0307/305 alloy powder, ensuring SMT solder paste printability, reflow stability, and residue transparency while keeping the per-kilogram cost within an industry-advantageous range.
Published: 2009-05-01To address the frequent occurrence of cold solder joint defects on SMT production lines, this domestic solder paste, through optimized alloy powder ratio and flux activity design, achieves nearly 100% solder wetting rate on QFN/DFN devices while significantly reducing void rate. Its multiple product lines, including halogen-free, zero-halogen, water-washable and laser-compatible variants, cover different process requirements, making it a cost-effective anti-cold-solder-joint solder paste solution to replace imported SMT solder pastes.
Published: 2009-04-19To address the frequent solder whisker issues on SMT production lines, domestic anti-whisker solder paste significantly suppresses solder tip formation without reducing solder wetting rate by optimizing alloy powder morphology, particle size distribution, and flux rheological properties. Models such as LFP-JJY5RQ-0307T4 and LFP-JJY5RNTT-305 have been experimentally verified to be compatible with QFN packages below 0.3mm, making them a cost-effective domestic solder paste solution to replace imported SMT solder paste.
Published: 2009-04-17Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.