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Loss of temperature and humidity control in the SMT printing workshop will cause fluctuations in solder paste viscosity, leading to defects such as insufficient solder, solder bridging, and misalignment. Jiajinyuan solder paste has the most stable viscosity under an environment of 22℃±2℃ and 45%RH±5%RH. When the temperature difference exceeds 3℃ or the humidity deviation exceeds 8%RH, the printing defect rate will rise. Process control must be achieved through closed-loop monitoring and zoned humidity control.
Published: 2011-03-20Domestic solder covers wire diameters from 0.3mm to 3.0mm, all temperature ranges (183℃~227℃) for both leaded and lead-free variants, and three flux systems: rosin, no-clean, and water-washable. It is compatible with multiple scenarios including high-speed SMT printing, wave soldering, dip soldering, and manual touch-up soldering. The Jiajinyuan series has a measured wetting angle ≤35°, bridging rate below 0.08%, and residual ion content <0.5μg/cm2. No adjustment to stencil apertures or reflow temperature profile is required when switching materials on the production line.
Published: 2011-03-06Silver-plated board soldering is a critical step in the SMT process where abnormalities such as pad blackening, poor wetting, and excessively thin IMC layers are prone to occur. Based on actual production line cases from Jia Jinyuan, this article focuses on the dependence of silver-plated board soldering on the quality of PCB silver surface treatment, and provides a detailed explanation of practical key points such as silver layer thickness control, OSP residue impact, reflow profile adaptation, and stencil aperture compensation.
Published: 2011-01-0401005 micro component SMT soldering imposes stringent requirements on solder paste particle size, rheological properties and reflow performance. Jiajinyuan J-01005 dedicated ultra-fine powder solder paste adopts Type 7 (D50=3.5μm) metal powder and a low-volatility flux system. Under conditions of stencil aperture ≤0.12mm, squeegee pressure 0.35MPa, and printing speed 25mm/s, it can achieve a solder paste transfer rate of over 98.7%, significantly reducing bridging, insufficient solder and tombstoning defects.
Published: 2010-09-28SMT stencils directly affect solder paste release rate and void rate in optimizing the aperture ratio of pads under BGA/QFN. Actual measurements by JJY show that an aperture ratio of 0.72～0.85 can balance the filling performance of QFN thermal pads and the risk of bridging for BGA fine-pitch solder balls. Too low a ratio easily leads to cold solder joints, while too high a ratio causes tombstoning or solder balls.
Published: 2010-05-11Solder used in electronics manufacturing plants must achieve dynamic matching across all processes including SMT placement, wave soldering, and touch-up soldering. Jiajinyuan solder adapts to complex thermal stress scenarios with reflow peak temperature of 235℃, wave soldering temperature of 260℃, and manual touch-up soldering instantaneous temperature of 380℃ through melting point gradient design. Its active residue content is controlled within 0.012%, avoiding ICT test leakage and excessive ion contamination.
Published: 2010-03-28High-frequency PCB soldering is a core step in 5G high-frequency PCB SMT soldering, which directly determines signal integrity and transmission stability in the millimeter-wave frequency band. Jiajinyuan has verified on substrates including FR4, Rogers, and Taconic that the solder paste filling rate of 0.15mm micro-via pads is >92%, and the post-reflow coplanarity is ≤18μm. By optimizing squeegee pressure and trapezoidal compensation for stencil apertures, the high-frequency PCB soldering yield is stably maintained above 99.3%.
Published: 2010-01-11Cold solder joint is a fatal defect common to wave soldering and SMT reflow soldering, with causes spanning multiple stages such as solder paste printing misalignment, oven temperature profile mismatch, PCB pad oxidation, insufficient flux activity, and conveyor speed fluctuations. Jia Jinyuan production line data shows that over 65% of soldering defects caused by cold solder joints stem from insufficient preheating and deteriorated interfacial wetting when nitrogen purity is below 99.99%.
Published: 2009-11-12SMT solder paste selection must closely align with the actual pain points of the production line. Domestic solder pastes vary significantly in QFN solder wetting rate, halogen residue, void control, and laser welding compatibility. The 8MQP/5RQ series achieves nearly 100% solder wetting, the 8M9P/5RR zero-halogen variant matches the high-heat scenarios of automotive lighting, and the water-washable 8MW5/5RW5 meets the welding needs of both stainless steel and aluminum materials. The alloy powder grade (T3-T7), halogen grade (ROL0 to ROL1), and temperature window of placement solder paste must be strictly matched with equipment capabilities and product reliability requirements.
Published: 2009-06-04Based on production line measurements, this paper compares the performance of domestic no-clean solder paste in terms of QNP solder wetting rate, halogen residue, void control, and printing stability. It focuses on analyzing the process adaptability of three JIAJINYUAN SMT solder pastes—8MQP/5RQ, 8MNTTP/5RNTT, and 8M9P/5RR—on high-precision communication boards and automotive lighting boards, providing reproducible parameter references for the selection of domestic solder paste.
Published: 2009-06-02Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.