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Here you can find knowledge about Peak Reduction Solder Paste, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
Cold soldering is the most hidden fatal defect in SMT production lines. Insufficient reflow peak temperature prevents the solder paste from fully melting and wetting the pads, resulting in cold solder joints and false soldering. Jia Jinyuan solder paste can only complete the eutectic reaction above 183°C, and its wetting force drops sharply when the temperature is below 205°C. Cold solder joints have a gray surface without metallic luster, and the thrust test value is more than 50% lower than the standard value.
Published: 2024-06-15
The 5000㎡ standardized factory building accommodates 96 production lines, fully supporting the large-scale and stable delivery of multiple series of halogen-free and lead-free solder pastes. The elastic release capacity during peak seasons has been significantly improved, and the average customer delivery cycle has been shortened by 3~5 working days, especially ensuring the solder climbing rate and void requirements for communications, automotive electronics, high-precision consumer terminals, etc.
Published: 2018-07-12The process window setting for lead-free solder paste reflow soldering must balance the coordinated control of peak temperature and soaking zone. Jia Jinyuan lead-free solder paste performs stably in the peak temperature range of 235°C to 245°C. However, if the soaking zone temperature is below 150°C and the duration is less than 60 seconds, it can easily lead to poor wetting and increased void rate. In actual production lines, the conveyor speed and the power of each temperature zone need to be dynamically adjusted based on the measured curves from a temperature profiler.
Published: 2018-06-18Excessively high peak reflow temperature of solder paste will directly lead to excessive growth of intermetallic compounds in solder paste joints, intensified dissolution of pad copper, and thermal damage to component bodies. In actual production lines, common defects include cold solder joints, solder balls, tombstoning, and PCB delamination. This problem mostly stems from inaccurate temperature profile settings, drift of furnace temperature sensors, or uncalibrated differences in activity between different batches of solder paste.
Published: 2015-12-10The reflow parameters of solder paste directly affect solder joint wettability, void rate and component reliability. An excessively fast heating rate can easily cause solder beads and PCB warpage, while insufficient peak temperature leads to cold soldering, and excessively high peak temperature will damage heat-sensitive devices. In actual production lines, the solder paste reflow profile needs to be dynamically adjusted according to the solder paste model, PCB thickness and component layout.
Published: 2012-07-19Cold soldering problems often stem from the fact that the actual peak temperature of the reflow oven fails to reach the solder paste activity window. Production line verification by Jiajinyuan shows that conducting oven temperature tests at least once a week can stably control the cold soldering defect rate within 300ppm. The fluctuation range of each temperature zone is measured using a KIC temperature profiler to ensure sufficient solder paste melting and that the thickness of the intermetallic compound (IMC) layer meets the standard.
Published: 2009-06-07Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.