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Solder paste spattering during reflow soldering is mostly caused by printing misalignment, unreasonable stencil aperture design, excessive squeegee pressure, or sudden changes in solder paste viscosity. Selecting anti-spattering solder paste with high thixotropy and low spattering tendency can significantly improve the issue. Domestic solder pastes such as Jiajinyuan LFP-JJY5RNTT-0307 (halogen 100~200ppm) and LFP-JJY5RR-0307 (halogen-free) deliver stable performance in QFN solder wetting rate and void control, making them a cost-effective alternative to imported reflow soldering solder pastes.
Published: 2009-03-26Low-silver solder paste significantly reduces material costs while ensuring soldering reliability. SMT solder paste selection must balance wetting rate, void rate, and residue characteristics. Domestic solder pastes such as the 8MQP/5RQ and 8MNTTP/5RNTT series, with their 0307/305 alloy powder, ROL0-level halogen control, and T4/T5 fine powder distribution, achieve cost-effective substitution in QFN/DFN packages and high-precision consumer electronics.
Published: 2009-03-24SAC305 solder paste is the mainstream lead-free solder paste. Its melting point of 217°C and soldering window of 235–255°C are compatible with most reflow processes. Domestic solder paste brands such as Jiajinyuan LFP-JJY5RQ-305, LFP-JJY5RR-305 and LFP-JJY5RNTT-305 stand out in halogen control, wetting ability and void rate, balancing high activity and low residue, and have become a reliable alternative for QFN/DFN packaging, automotive electronics and other scenarios.
Published: 2009-03-22SnBi solder paste has become a key material for soldering heat-sensitive components due to its low melting point of 138–172℃. Domestic solder paste has achieved mass production of mature formulations such as Sn42Bi58 and Sn64Bi35Ag1 in the low-temperature solder paste field. The Jiajinyuan LFP-JJY2R-64351 and LFP-JJY5RW1A-4258 series have verified process stability in printability, wettability and low void rate in scenarios such as LED transparent screens, copper wire lamps and aluminum nickel-plated heat sinks.
Published: 2009-03-20This article summarizes 12 mainstream domestic solder paste series, covering the full-scenario requirements of SMT soldering solder paste, including high solder climbing rate for QFN/DFN, low voidage for automotive lamps, laser dispensing compatibility, soldering of stainless steel and aluminum, and ultra-low temperature packaging. It focuses on analyzing the practical differences of the Jiajinyuan LFP-JJY series in halogen control, alloy powder particle size distribution, and T3-T7 particle size selection, providing production-line-level parameter basis for chip solder paste selection.
Published: 2009-03-18Facing the practical pain points of imported solder paste such as long delivery cycles, high costs, and slow technical support response, domestic solder paste has achieved full-scenario coverage, from high solder climbing rate in QFN/DFN, zero-halogen low voiding, laser dispensing compatibility to water washability. The LFP-JJY series SMT solder paste, through 0307/305/T4-T4 alloy powder systems and ROL0-level halogen control, has become a reliable alternative to imported solder paste.
Published: 2009-03-16In response to the stringent requirements of SMT production lines for stably stored solder paste, this paper, based on the measured performance of Jiajinyuan domestic solder paste, focuses on recommending three high-stability rosin-based halogen-free lead-free high-temperature solder pastes: 8MQP/5RQ, 8MNTTP/5RNTT, and 8M9P/5RR. They can be stably stored at 25℃ for 6 months without oil separation or stratification, and the T4/T5 fine powder ratio balances printability and reflow wetting ability, making them a reliable choice to replace imported SMT solder paste.
Published: 2009-03-14Domestic solder paste has achieved key breakthroughs in the field of temperature-stabilized solder paste. With 0307/305 alloy powder T4-grade fineness, ROL0-grade ultra-low halogen residue and rosin-based system, Jiajinyuan LFP-JJY5RQ and 5RNTT series have demonstrated excellent temperature recovery stability and delamination resistance in actual tests where the QFN solder climbing rate is nearly 100% and the void rate after reflow is below 8%, making them a cost-effective choice for replacing imported products in SMT solder paste production lines.
Published: 2009-03-12Dispensing solder paste, dot solder paste, and domestic solder paste must strictly match the process
Published: 2009-03-10Communication motherboards have extremely high requirements for solder paste's wetting ability, residue transparency, and halogen control. The 8MNTTP/5RNTT series communication board solder paste launched by domestic solder paste brand Jiajinyuan contains only 100~200ppm halogen, with minimal and transparent residue. It is compatible with high-density packages such as QFN/DFN, and achieves high-reliability solder paste performance when paired with 00507BN/T5 ultra-fine powder. It has been batch-verified on 5G base station motherboards.
Published: 2009-03-08Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.