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Continuous printing solder paste directly affects yield and line changeover efficiency in SMT production lines. Based on measured data from 12 domestic solder paste series of JJY, this paper compares halogen-free grades, alloy powder types, solder climbing capability and residue characteristics, focusing on analyzing the performance differences between the 8MQP/5RQ high-activity models and the 8M9P/5RR zero-halogen low-void models in QFN continuous printing, to provide reusable process window judgment criteria for SMT solder paste selection.
Published: 2009-05-05For high-volume SMT production lines, the quality stability of domestic solder paste directly determines the first pass yield and rework cost. The 8MQP/5RQ series achieves nearly 100% solder wetting rate for QFN packages, with both halogen indicators below 1500ppm; the 8M9P/5RR series is halogen-free with an extremely low void rate, making it suitable for high-heat scenarios such as automotive lighting. These mass-produced solder pastes have been validated at multiple leading EMS manufacturers for over 6 consecutive months with no batch-related failures. Solder paste selection for SMT must match the reflow profile window and device pad design. Domestic solder paste has evolved from being usable to being reliable.
Published: 2009-05-03For production lines with tight budgets but non-negotiable welding quality, Jiajinyuan's domestic solder paste centers on its halogen-free, lead-free high-temperature series, covering scenarios such as high solder climbing for QFN/DFN, precision welding of communication equipment, and low voiding for automotive lamps. It offers economical solder paste with T3/T4 grade 0307/305 alloy powder, ensuring SMT solder paste printability, reflow stability, and residue transparency while keeping the per-kilogram cost within an industry-advantageous range.
Published: 2009-05-01Medium-temperature solder paste for electronic assembly is irreplaceable in soldering temperature-sensitive devices such as LEDs, crystal oscillators, copper wire lights, and transparent displays. The 8M/2R series medium-temperature solder paste launched by domestic solder paste brand Jiajinyuan is compatible with alloys such as Sn64Bi35Ag1, with a melting point of 151–172℃ and a soldering temperature of 195–220℃. It balances wettability and low thermal stress, and ensures printing accuracy with T2.5–T5 grade fine powder particle size, making it a cost-effective choice to replace imported medium-temperature solder paste.
Published: 2009-04-29In repair prototyping scenarios, syringe solder paste selection must balance solder wetting performance, residue transparency, and equipment compatibility. Among domestic solder pastes, the Jiajinyuan 8MQP/5RQ series achieves nearly 100% solder wetting on QFN/DFN devices, while the 8MNTTP/5RNTT series contains only 100~200ppm of halogens with transparent residues, making it particularly suitable for high-precision repair solder paste needs such as mobile phones and Bluetooth devices.
Published: 2009-04-27Multiple domestic solder pastes were tested for key indicators including QFN solder climb rate, void control, and residue transparency. PCB solder paste selection must match the specific process window. The activity of soldering paste is inversely proportional to its halogen content. Domestic solder pastes now cover the full gradient from zero-halogen ROL0 to halogen-free ROL1. 8M9P/5RR achieves automotive lighting-grade low void rates, while 8MNTTP/5RNTT achieves over 90% solder climb on high-density pads of mobile phone motherboards.
Published: 2009-04-25Addressing the printing challenges of 0201 small components, domestic solder pastes need to balance the high-resolution transfer rate and low voiding rate of fine-powder solder pastes. Two 0201 solder pastes, Jiajinyuan LFP-JJY5RNTT-0307 and LFP-JJY5RR-0307, are recommended. The former contains 00507BN/T5 fine powder with 100~200ppm halogen, suitable for high-precision consumer electronics. The latter is halogen-free ROL0 grade with T4 powder, featuring outstanding thermal cycling reliability, and has achieved 98.7% solder joint coverage on mobile phone motherboard production lines.
Published: 2009-04-23To address the mounting challenges of 01005 micro components, domestic solder paste brands have achieved stable printing and solder wetting of high-density solder pastes in openings below 0.3mm through the synergistic optimization of T4/T5 grade ultra-fine alloy powder, ROL0 grade ultra-low halogen control, and rosin-based active systems. Among them, the 8MNTTP/5RNTT series achieved over 92% solder joint coverage in actual tests on mobile phone motherboards, significantly outperforming conventional T3 powder solutions.
Published: 2009-04-21To address the frequent occurrence of cold solder joint defects on SMT production lines, this domestic solder paste, through optimized alloy powder ratio and flux activity design, achieves nearly 100% solder wetting rate on QFN/DFN devices while significantly reducing void rate. Its multiple product lines, including halogen-free, zero-halogen, water-washable and laser-compatible variants, cover different process requirements, making it a cost-effective anti-cold-solder-joint solder paste solution to replace imported SMT solder pastes.
Published: 2009-04-19To address the frequent solder whisker issues on SMT production lines, domestic anti-whisker solder paste significantly suppresses solder tip formation without reducing solder wetting rate by optimizing alloy powder morphology, particle size distribution, and flux rheological properties. Models such as LFP-JJY5RQ-0307T4 and LFP-JJY5RNTT-305 have been experimentally verified to be compatible with QFN packages below 0.3mm, making them a cost-effective domestic solder paste solution to replace imported SMT solder paste.
Published: 2009-04-17Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.