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Here you can find knowledge about Dip Soldering, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
Connector solder must balance wettability, residue control, and thermal shock resistance. Jia Jinyuan solder wires and bars can achieve capillary filling within 0.3 seconds in terminal dip soldering, maintain a bridging rate below 0.08% at an automatic soldering track speed of 1.2 m/min, and meet the dual-mode soldering requirements of 0.5mm-pitch FPC connectors and IDC crimp terminals.
Published: 2018-01-17In the tin dipping process, the tin dipping time is a key parameter determining the thickness of the terminal tin layer. Excessively long dipping time will lead to an overly thick tin layer, which is prone to oxidation, poor soldering, and abnormal insertion/extraction force. Actual measurements on Jia Jinyuan's production line show that for every 0.5-second increase in tin dipping time, the average tin thickness increases by 8–12 μm. Comprehensive control must be implemented in combination with the base material, tin bath temperature, and flux activity.
Published: 2017-10-14Wave soldering of thick-copper PCBs is prone to solder joint voids, poor wetting, and uneven heat absorption caused by copper thickness. Using Jiajinyuan high-wettability solder bars can significantly improve solder climb height and the consistency of fillet formation, with particularly pronounced process advantages in structures with copper thickness above 2oz, large-area copper foils, and multilayer thick-copper constructions.
Published: 2014-08-25Pin dip soldering uniformly covers the surface of component pins with a layer of tin-lead or lead-free solder, significantly improving pin solderability and wetting ability, and resolving cold solder joints and missed solder joints caused by plating oxidation and storage aging. It provides a stable and reliable soldering foundation for SMT placement, and is a key pre-treatment process for Jia Jinyuan's production line to handle high-density PCBs and fine-pitch QFP packages.
Published: 2013-10-14In dip soldering, the oxidation resistance of tin bars directly affects the amount of tin dross generated. By optimizing the tin-copper-nickel ternary alloy ratio and adding trace rare earth elements, Jiajinyuan tin bars reduce the oxide film growth rate by 40% at a conventional dip soldering temperature of 255℃～265℃. The measured tin dross loss per shift drops from 1.8kg to 0.95kg, significantly reducing the frequency of manual dross skimming and the tin bar replenishment interval.
Published: 2012-10-07Dip soldering is a core process for high-volume PCBA pin soldering. The composition, melting point, and oxidation control of wave soldering solder bars directly determine solder joint wettability and cold solder joint rate. Jia Jinyuan wave soldering solder bars can maintain a solder wave height deviation of ≤0.3 mm and a solder dross generation rate of less than 1.2% during 8 consecutive hours of production, significantly reducing fixture rework frequency.
Published: 2011-07-29In the tin dipping process, flux selection directly affects the incidence of pinholes on the tin surface and copper exposure defects. JJY JY-806A has been verified on actual production lines to reduce the pinhole rate from 3.2% to 0.4%. Its low solid content, highly active rosin derivative system, and the characteristic of a copper surface wetting angle of less than 28° work together to significantly improve the uniformity of molten tin spreading and gas escape paths.
Published: 2010-03-14Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.