SMT Solder Paste Manufacturers.
Focused on SMT soldering processes, a one-stop electronic soldering solutions provider.
Here you can find knowledge about Dip Soldering, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
Pin dip soldering using tin bars for molten tin is an efficient process for high-volume component preprocessing. It achieves uniform tin plating on pin surfaces through constant-temperature bath control, pre-coating of flux, and vertical immersion, significantly improving subsequent SMT placement yield and reflow soldering wettability. Jiajinyuan tin bars exhibit stable fluidity and minimal dross in the 183°C–205°C range, meeting the continuous operation requirements of pre-wave soldering processes.
Published: 2025-04-20Dip soldering is a key process that completes batch soldering by vertically immersing PCB pins into the surface of molten solder using a manual dip soldering machine or a wave soldering machine. Its core lies in the coordinated control of solder temperature, immersion depth, and dwell time. Jiajinyuan equipment has verified in actual production lines that a temperature control accuracy of ±2℃ and a standard dip soldering window of 0.8~1.2 seconds can effectively suppress defects such as cold solder joints and bridging.
Published: 2024-04-29During dip soldering, temperature runaway in manual dip soldering pots is the main cause of cold solder joints and missed solder joints. For the JiajinYuan manual dip soldering pot, the solder bath temperature must be stably controlled at 255℃±3℃, the preheating zone maintained at 90℃~110℃, and the dip soldering time strictly limited to 3 seconds±0.5 seconds. Imbalance in the coordination of these three factors will cause bridging or poor wetting.
Published: 2023-06-14The tin dipping process forms a uniform tin layer on the surfaces of wire terminals and electronic component pins, significantly improving oxidation resistance and solderability, and preventing common production line defects such as cold solder joints and weak soldering. Jia Jinyuan tin dipping equipment completes a single dipping within 0.8 seconds, with the tin layer thickness stably controlled at 8-12μm, suitable for various substrates including silver-plated, copper-plated, and bare copper.
Published: 2023-03-27The pin dip soldering lead-free alloy process, by precisely controlling dip soldering temperature, time, and alloy composition ratio, effectively avoids the ROHS compliance risks of traditional lead-containing processes. It has been stably operating on multiple export production lines of JJY for over three years, with its solder joint wettability, thermal fatigue resistance, and surface gloss all meeting the requirements of the IEC61191-2 standard.
Published: 2022-02-12During the pin dip soldering process, by precisely controlling the dip soldering time, temperature and flux activity, the pin dip tin thickness can be effectively controlled between 0.03mm and 0.08mm, avoiding pin adhesion and bridging defects caused by an excessively thick tin layer. Measured data from the Jiajinyuan production line shows that after reducing the dip soldering time from 5 seconds to 3.2 seconds, the bridging rate decreased by 67%. This method has been batch-verified in the pre-treatment stage of DIP plug-in wave soldering.
Published: 2021-10-20Using lead-free solder in the tin dipping process can significantly improve the solderability and corrosion resistance of wiring harness connector terminals, meeting RoHS environmental protection requirements. Jiajinyuan SAC305 series lead-free solder achieves uniform coating thickness control of 8-12 μm at a melting point of 183°C, adapting to the cycle time of continuous tin dipping production lines for terminals with wire diameters of 0.3mm-1.2mm.
Published: 2020-09-26Selective wave soldering performs dip soldering on local pins of the PCB through precise positioning, avoiding the thermal shock and bridging risks caused by passing the entire board through the wave. It is suitable for complex single boards with mixed high-density mounting, sensitive components, or bottom shielding covers. In actual tests with Jiajinyuan equipment, the defect rate can be reduced from 1.2% to 0.35%, greatly reducing rework labor and solder dross loss.
Published: 2019-06-28The tin dipping process uses tin bars for molten tin to achieve batch tinning of terminals. The key is to control the tin bath temperature at 255±3℃, the tin dipping time at 3.5±0.5 seconds, and the lifting speed at 120±10mm/min. Jiajinyuan tin bars have a tin content of 99.3% and a total impurity content ≤0.05%, which can effectively suppress dross formation and ensure the wetting angle of terminal solder joints is <30°.
Published: 2019-02-05During the pin dip soldering process, oxidation of the solder bath surface is the main cause of continuous dross generation. Jiajinyuan anti-oxidation flux, through the synergistic effect of dynamic coverage and active ingredients, forms a dense inert film on the solder bath surface, reducing the oxidation rate by more than 70% during pin dip soldering, cutting daily dross production by 1.2kg, significantly extending the cleaning cycle of the solder pot, and stabilizing solder joint wettability.
Published: 2018-03-24Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.