LP-NC-559-0H is a no-clean zero-halogen lead-free flux paste with very light residue color and an extremely high SIR value, ideal for rework and solder-ball replacement of ball-grid solder joints such as BGA and CSP. Suitable as a rework flux for SMD components such as mobile-phone PCBs, BGA and PGA, it uses a low-ion activator system with fast tinning and very low fuming; the cured residue has a very high surface insulation resistance, so it causes very little electrical interference to communication products such as mobile phones.