The LFP-5RNTT series halogen-free and lead-free high-temperature Solder Paste includes two models, LFP-5RNTT-305 and LFP-5RNTT-0307, and is a key product of Jia Jinyuan in the field of environmentally friendly Soldering Materials. With low halogen residue and high-reliability soldering as its core selling points, the product is widely used in consumer electronics and industrial control fields.

The Flux system of this series of solder paste adopts halogen-free activation technology, resulting in extremely low halogen residue after soldering, which can easily pass the tests of environmental directives such as RoHS and REACH. The residue is transparent, and its impact on the surface insulation resistance of PCB is negligible, making it suitable for fine-pitch and high-density assembly.

In terms of printing process, the LFP-5RNTT series solder paste has excellent stencil release performance. The T5 and T6 powder particle size specifications meet the soldering requirements of BGA and CSP components with 0.4mm and 0.3mm pitch respectively. The solder paste can stay on the stencil for more than 8 hours without abnormal viscosity changes.

After soldering, the solder joints are full and bright, with low void rate and moderate IMC layer thickness. The reliability of the solder joints meets the requirements of J-STD-004 and IPC-A-610 Class3 standards, making it an ideal choice for high-end electronic product manufacturing.