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JJYLead-free solder paste manufacturertheSMTThe reflow soldering specification refers to the tempera
Published: 2026-05-12In the production processLead-free solder pasteWhat problems may occur during reflow soldering opera
Published: 2026-05-12
If you find that the edges of the solder paste are uneven, there are burrs or stains on the surface
Published: 2026-05-12
It is understood that it is in normal useSMTWhen steel mesh is subjected to surface mount technology
Published: 2026-05-12
Industry research shows that SMT solder process optimization has become a core lever for production line upgrades at electronics manufacturing enterprises. Multiple leading EMS manufacturers are launching empirical projects in Q1 2026, including dynamic compensation for reflow oven temperature zones, fine-tuning of solder alloy composition, and 3D simulation of stencil apertures. The wettability, void rate, and long-term thermal cycling reliability of SMT solder are emerging as key metrics for process validation.
Published: 2026-05-08
Solder paste begins to deteriorate rapidly after being exposed to room temperature for more than 4 hours. This deterioration is significantly accelerated when ambient humidity exceeds 60%RH or temperature exceeds 25℃, as viscosity increases, metal particle settling and flux delamination become markedly more severe, directly impacting the shelf life of the solder paste and printing yield. Production lines must strictly control the time window between taking the solder paste out of cold storage and putting it into use on the machine.
Published: 2026-04-22
Industry observations indicate that in the fourth quarter of 2025, EMS capacity expansion in Southeast Asia accelerated, with over 140 new SMT placement lines added in Vietnam and Malaysia, of which 67% of production lines explicitly require solder suppliers to hold IATF 16949 automotive electronics compatibility certification and possess localized rapid response capabilities.
Published: 2026-04-19
Starting from January 1, 2026, multiple leading SMT solder suppliers, in collaboration with production line process teams, have completed a new round of reflow soldering adaptability optimization. By adjusting the metal powder particle size distribution and flux activity gradient, the cold solder joint rate of SMT solder in 0.3mm pitch CSP package soldering has been reduced to 0.08%.
Published: 2026-04-14
SMT solder technology iteration has accelerated significantly. Starting from January 2026, enterprises including Senju, Shengmao, VTTI, and Yunchuang Precision have collectively released new SMT solder solutions such as low-void-rate lead-free solder paste, high-temperature reflow compatible solder paste, and low-spatter formulations for nitrogen environments. The products focus on three major directions: high reliability, fine-pitch compatibility, and green process compatibility, responding to the stringent requirements for soldering consistency in 5G communication modules, automotive-grade MCUs, and AI server PCBs.
Published: 2026-04-11
SMT solder applications are rapidly expanding from traditional consumer electronics to high-reliability scenarios such as photovoltaic inverters, energy storage BMS, and new energy vehicle electronic control systems. Since January 2026, multiple leading solder manufacturers have reported that orders from new energy customers have exceeded 35%. The combined application of lead-free high-temperature alloy solder and low-temperature sintered silver paste has become a key support for production line upgrades.
Published: 2026-04-09Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.