Low-temperature lead-free solder paste — what are its advantages? Generally, this type contains bismuth (Bi) and is a bit more brittle. Aluminum-substrate LED high-power lamps mostly use low-temperature Solder Paste, which has a melting point of 138℃. Products that cannot withstand high temperatures can only use low-temperature solder paste, but its soldering performance is not as good as that of high-temperature solder paste. The main reason for using low-temperature solder paste is that the product design cannot withstand conventional temperature requirements, such as LED or COB PCBs.
Low-temperature solder paste also has its advantages and disadvantages:
Disadvantages: Low-temperature solder paste is a Sn-Bi alloy, and its solder joints are prone to brittle cracking, so it is not suitable for products with general strength requirements. In addition, components are prone to falling off when using low-temperature solder paste — especially connector products that need to be plugged and unplugged during assembly are very likely to fall off.
Advantages: Low-temperature solder paste is relatively cheaper than medium-temperature and high-temperature solder paste because it contains silver, which reduces costs. Also, because the melting point of low-temperature solder paste is 138℃, lower furnace temperatures reduce energy consumption.
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