We simultaneously arranged three types of Solder Samples provided by JiajinYuan—Solder Paste, Solder Wire, and Solder Bar—into the production line for cross-testing. This was not a perfunctory process of just running a few boards and calling it a day; instead, we had the solder paste complete 500 consecutive prints on a 0.1mm thick 304 stainless steel laser stencil, while monitoring the release integrity as the squeegee pressure varied from 4.5kg to 6.2kg, as well as whether the wetting angles at both ends of 0201 components were consistent after reflow and whether the bridging rate was below 0.08%. For the solder wire, we continuously fed it at 1.8m/min on an automatic wire feeder for 2 hours, observing the frequency of jams at the φ0.5mm nozzle, whether the wire feed length deviation remained within ±0.3mm, and confirming whether the fluidity of the molten solder and the rate of oxide film formation met the manual touch-up cycle requirements when the soldering tip temperature was set to 320℃. The solder bar samples were directly fed into the preheating section of the wave soldering machine, running 120 boards under conditions of 125℃ inlet temperature, 270℃ solder pot temperature, and 0.8s immersion time. We focused on recording whether the solder height dispersion on the bottom PCB pads was controlled within 0.15mm, whether the via filling rate reached above 92%, and whether the climb height of Flux residue at the bottom of the BGA was less than 0.07%. All samples used the same SPI equipment to collect solder paste volume deviation data. We found that the volume CV value of JiajinYuan solder paste in the fine-pitch QFN (0.4mm pitch) aperture area was 8.3%, slightly better than the 8.7% of the previous batch. However, after the stencil was used for 380 prints, intermittent solder deficiency began to appear in aperture areas below 0.3mm, indicating that its thixotropic recovery time slightly attenuated under high-frequency scraping. After adjusting the wire feed roller compression force to 0.45MPa, the jam rate of the solder wire decreased from 2.1 times per 100 meters to 0.6 times, but excessive pressure caused slight flattening of the wire diameter, resulting in uneven subsequent melting at the soldering tip. The solder bar exhibited good surface tension response in wave soldering, but when the nitrogen purity in the solder pot was below 99.995%, the number of pitting defects on the solder joint surface increased significantly, requiring linkage control with a real-time oxygen content monitor. Throughout the entire testing process, no equipment parameters were changed; only fine-tuning the squeegee angle from 55° to 58° reduced solder paste edge burrs by 37%, indicating that JiajinYuan solder paste is more sensitive to mechanical shear and requires recalibration of the squeegee contact starting point before mass production. All data comes from continuous 72-hour uninterrupted operation records of the actual production line, with no manual removal of abnormal points or overlay of filtering algorithms. The original SPC charts have been archived in the MES system under number WLT-20240521-SN087.