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Here you can find knowledge about High-Activity Solder Paste, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
When manually soldering and repairing old PCBs, oxidized solder pads cause poor tinning and frequent cold solder joints. High-activity solder wire significantly improves the first-pass soldering success rate through stronger oxide film penetration and lower wetting temperature, and is especially suitable for manual soldering rework scenarios of communication boards and industrial control motherboards in service for over 8 years.
Published: 2021-06-22For reworking oxidized PCB pads, two issues must be addressed simultaneously: the surface oxide layer and poor wetting. Jia Jinyuan high-activity flux can effectively reduce CuO and lower interfacial tension. Combined with light mechanical scraping and nitrogen-protected reflow, it raises the first-pass rework yield of oxidized pads to over 92%, significantly outperforming the 65% achieved by traditional rosin-based flux.
Published: 2012-09-29Poor wetting of oxidized old pads during rework soldering is a high-frequency production line failure. Jia Jinyuan JY-808 high-activity flux can effectively reduce the CuO layer and lower surface tension. Combined with precise temperature-controlled soldering tip operation in a 350°C nitrogen environment, it increases the spread rate of solder paste on oxidized copper pads from less than 40% to over 92%, significantly shortening the rework cycle and reducing missed detection of cold solder joints.
Published: 2012-07-22High-activity solder paste is specifically designed for sensor soldering applications, delivering excellent wetting performance on heavily oxidized PCB pads. It effectively resolves cold solder joints and tombstoning defects caused by pad oxidation after high-temperature storage, multiple reflow cycles, or long-term exposure with conventional solder pastes. It is particularly well-suited for the fine pads and low thermal mass requirements of precision sensors such as MEMS, pressure, temperature and humidity sensors.
Published: 2010-11-12The practical performance of high-activity solder paste in achieving nearly 100% solder wetting rate for fine-pitch QFN/DFN devices directly determines the success or failure of domestic solder paste brand selection. Based on the measured data of Jia Jinyuan LFP-JJY series halogen-free and lead-free high-temperature solder paste, this paper compares the differences in residue transparency, halogen content, and alloy powder particle size distribution among models including 8MQP/5RQ, 8MTSP/5RTS, and 8MNTTP/5RNTT in the reflow soldering solder paste process, providing a directly applicable domestic solder paste replacement solution for SMT production lines.
Published: 2009-03-30Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.