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Poor wetting of oxidized old pads during rework soldering is a high-frequency production line failure. Jia Jinyuan JY-808 high-activity flux can effectively reduce the CuO layer and lower surface tension. Combined with precise temperature-controlled soldering tip operation in a 350°C nitrogen environment, it increases the spread rate of solder paste on oxidized copper pads from less than 40% to over 92%, significantly shortening the rework cycle and reducing missed detection of cold solder joints.
Published: 2012-07-22
Common failures of soldering consumables in electronics factories directly hit production line pain points, covering solder paste printing misalignment, collapse, oxidation and skinning, solder wire soldering spatter, icicle formation, poor wetting, insufficient activity of soldering paste and whitening residue, etc. Combined with 20 years of SMT practical experience, immediately executable parameter adjustment and material control solutions are provided.
Published: 2012-04-18
Excessively high activity of solder paste can cause welding hazards such as solder joint voids, component corrosion, solder ball splashing, and whitening residue on the PCB surface. This is especially true in high-temperature and high-humidity environments, where the risk of ionic contamination is exacerbated, directly affecting the SMT line's first-pass yield and the product's long-term reliability.
Published: 2012-02-20The nitrogen reflow process significantly improves solder joint wettability and oxidation suppression in the soldering of thick copper boards and high-frequency boards. Especially for thick copper substrates of 2oz or above, which have large heat capacity and slow heating, when paired with JJY dedicated solder paste, the void rate can be stably controlled within 8%. Meanwhile, it prevents thermal delamination of high-frequency dielectric layers. This process has been batch-verified on multiple production lines for military products and base station RF modules.
Published: 2011-08-22The volatilization rate of solder paste flux directly affects the wettability, void rate, and bridging risk of solder paste joints. Excessively fast volatilization can easily lead to insufficient solder paste collapse and cold solder joints, while excessively slow volatilization leaves residual flux that causes splashing and solder balls. Based on 20 years of practical SMT production line data from Jiajinyuan, this paper analyzes the cascading impact of the actual volatilization behavior of solder paste flux under different temperature zone settings on the formation of solder paste joints.
Published: 2011-07-15
Flux paste residue must be thoroughly removed with a matching solder cleaning agent; otherwise, it will lead to false ICT test results, corrosion of gold wire solder joints, or reduced adhesion of conformal coating. In actual production lines, isopropyl alcohol-based cleaning agents deliver consistent results for rosin-based flux paste but evaporate quickly; water-based cleaning agents are suitable for no-clean flux paste but require extended rinsing time; hydrocarbon-based cleaning agents have strong solvency for high-solid-content flux paste but carry the risk of swelling equipment seals.
Published: 2011-02-03During the soldering process of immersion silver boards, excessively high flux activity will accelerate the oxidative corrosion of the silver layer, leading to blackened solder joints, poor wetting, and subsequent false judgments in ICT testing. By controlling the acid value of the flux, optimizing the reflow peak temperature and nitrogen purity, and combining with the precise selection of Jiajinyuan JY-806A medium-activity rosin-based flux, silver surface discoloration can be effectively suppressed, and the first-pass soldering yield can be improved.
Published: 2010-10-21Cold solder joint is one of the most frequent soldering defects on SMT production lines. Its cause is often misjudged as insufficient solder paste activity, but in fact, it mostly stems from the deterioration of pad solderability combined with mismatched flux activity. By specifically improving the wetting ability of the pad surface, selecting JJY JY-602 medium-high activity no-clean flux, and strictly controlling the OSP film thickness and nitrogen purity, the cold solder joint rate can be reduced from 3.2‰ to below 0.4‰ without changing the reflow profile.
Published: 2010-04-22In the tin dipping process, flux selection directly affects the incidence of pinholes on the tin surface and copper exposure defects. JJY JY-806A has been verified on actual production lines to reduce the pinhole rate from 3.2% to 0.4%. Its low solid content, highly active rosin derivative system, and the characteristic of a copper surface wetting angle of less than 28° work together to significantly improve the uniformity of molten tin spreading and gas escape paths.
Published: 2010-03-14
The proportion of flux in solder paste is usually controlled between 8% and 12%. This range can not only ensure the viscosity and release performance during printing, but also meet the dual requirements of active release and controllable residue during the reflow stage. Too high a proportion can easily lead to slump and splashing, while too low a proportion can cause poor wetting and cold soldering. The actual production line needs to be dynamically fine-tuned in combination with stencil apertures, ambient temperature and humidity, and reflow oven capabilities.
Published: 2009-06-02Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.