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Here you can find knowledge about Eutectic Solder, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
Eutectic solder Sn63Pb37 solder wires and bars are the preferred material for reworking high-density devices such as BGA and QFN in the repair industry, thanks to their precise 183°C melting point, absence of pasty range, and excellent wettability. Jia Jinyuan's products of this model have demonstrated extremely low bridging rates and stable tensile strength values in actual production lines. With common diameter specifications ranging from 0.5mm to 1.2mm, they meet the dual requirements of manual soldering iron welding and hot air gun solder replenishment.
Published: 2025-02-02Eutectic solder exhibits excellent forming stability in SMT reflow soldering. Since its solidus and liquidus temperatures coincide and its melting range is zero, it can avoid the common semi-molten state defects of traditional non-eutectic solder, significantly reducing the risks of cold solder joints, tombstoning, and poor wetting. It is especially suitable for mass production processes of high-density fine-pitch devices such as 0201 and 0.3mm pitch QFN.
Published: 2022-02-26Manual rework with eutectic solder offers a wide temperature window, fast wetting, and low voiding rate in actual production line operations. When paired with a constant-temperature soldering iron and a preheating platform, the peak temperature can be stably controlled at 183℃±5℃, significantly reducing the risks of BGA cold solder joints and PCB delamination, making it especially suitable for rapid-response scenarios involving small batches and multiple product varieties.
Published: 2021-06-08The selection of eutectic solder must closely focus on the two key hard indicators of melting point and ductility, as the melting point directly determines the width of the reflow profile window, while ductility affects the thermal fatigue resistance of solder joints. Jia Jinyuan's Sn63Pb37 eutectic solder melts precisely at 183℃ with an elongation rate stably above 45%, making it a reliable choice for mass production of automotive controllers and industrial power boards.
Published: 2018-08-13Eutectic solder has a fixed single melting point in SMT production lines, enabling simultaneous melting and solidification, which significantly reduces thermal stress and void rate. Under the Sn96.5Ag3.0Cu0.5 system, the measured melting point of Jia Jinyuan eutectic solder is stable at 217.5℃±0.3℃, suitable for reflow soldering process control of high-density packages such as BGA and QFN.
Published: 2013-10-28Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.