LFP-5RG-In52Sn48 Halogen-Free Lead-Free Ultra-Low-Temperature Solder Paste is a high-end welding material developed by Jia Jinyuan for extremely temperature-sensitive devices. It adopts the In52Sn48 indium-tin eutectic alloy system, with a eutectic melting point as low as 118°C, and the peak Reflow Soldering temperature can be controlled between 140°C and 160°C.

The low-melting-point characteristic of indium-tin alloy makes it the preferred material for soldering extremely temperature-sensitive devices, such as MEMS sensors, laser diodes, low-temperature ceramic capacitors and other devices that cannot withstand the high temperature above 217°C of conventional lead-free soldering. The LFP-5RG series further ensures the environmental compliance of the product through a zero-halogen Flux design.

This product adopts a special low-temperature activation system in its flux formula, which can still maintain sufficient activation ability in the low-temperature range to remove the oxide layer of the pad and ensure good wetting of the molten alloy. The solder joint forms a uniform and dense intermetallic compound layer, with excellent mechanical strength and electrical conductivity.

This product has been applied in fields such as high-end medical sensors, aerospace electronic devices, and precision optical modules, providing reliable low-temperature soldering solutions for these temperature-sensitive scenarios and filling the technical gap of domestic ultra-low-temperature solder paste.