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Here you can find knowledge about Soldering Auxiliary Materials, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
Although no-clean solder paste eliminates the cleaning process in SMT soldering, post-soldering residues can easily cause poor ICT probe contact, false judgments in flying probe testing, and missed detections in functional testing. Based on production line measured data, this paper proposes 6 actionable cost-reduction measures covering solder paste selection, stencil design, reflow parameters, and test fixture maintenance, which can reduce annual test misjudgment working hours by 1200 hours and reduce false rework costs by 84,000 yuan per plant.
Published: 2026-08-27
Improper temperature setting of the wave soldering pot is one of the main causes of cold solder joints, bridging, and poor wetting. There are significant differences in melting point and activity among different solder bar alloys. The wave soldering pot temperature must be accurately set according to the actual type of solder bar alloy used; otherwise, it can easily cause batch soldering defects.
Published: 2026-08-27
Solder paste warehouse management in SMT workshops is shifting from static temperature control to dynamic lifecycle tracking. Trends such as linked environmental temperature and humidity alarms, automatic timing of open-container duration, and batch-level modeling of thermal cycling-induced degradation are driving the upgrade of warehouse systems. Refined control of solder paste warehouse management has become the primary frontline defense to reduce soldering defects such as cold solder joints, tombstoning, and solder balls.
Published: 2026-08-27
In BGA rework, the amount of solder paste used and hot air temperature control directly determine solder joint reliability. The IPC-7711/21C standard explicitly requires that the deviation of solder paste volume must not exceed ±15%, and the reflow peak temperature must be controlled within the range of 235℃±5℃. Excessive temperature easily causes PCB delamination and chip cracking, while excessive solder paste leads to bridging and excessive void rate. In front-line practical operations, parameters need to be dynamically adjusted in combination with stencil thickness, chip solder ball diameter, and PCB copper foil density.
Published: 2026-08-27
In high-current terminal welding, improper solder wire selection and uncontrolled soldering iron temperature commonly cause cold solder joints, dry solder joints, or thermal damage to terminal base materials. This article directly addresses real-world misconceptions on production lines, covering six major pitfalls including flux residue corrosion, mismatched wire diameters with solder wire specifications, and temperature settings that ignore heat capacity differences. It emphasizes that terminal welding must reverse-engineer solder wire activity grade and diameter based on current-carrying capacity, and dynamically adjust soldering iron temperature according to terminal material thickness.
Published: 2026-08-27
SMT for automotive industrial control boards has extremely high requirements for soldering reliability; even minor deviations in solder paste control can trigger batch defects such as cold solder joints, solder bridges, and tombstoning. This article directly addresses real-world misconceptions on the production line, covering five high-incidence issues: temperature control failure during solder paste storage, insufficient reflow time, mismatched squeegee pressure, mismatch between stencil aperture design and solder paste particle size, and excessive dwell time after printing. Each point is derived from measured failure cases, emphasizing that solder paste control in industrial control board SMT must run through the entire process from material requisition to component placement.
Published: 2026-08-27
The compatibility between wave soldering flux and solder bars directly affects solder joint gloss, wetting uniformity, and residue morphology. Based on production line measured data, this paper horizontally compares the combined performance of three types of fluxes—rosin-based, no-clean, and water-soluble—paired with 63/37, 60/40, and SAC305 solder bars respectively. The analysis is conducted from four dimensions: wetting angle variation, solder joint reflectivity, bridging occurrence rate, and cleaning difficulty. It is clarified that for scenarios requiring high gloss, rosin-based flux paired with 63/37 solder bars is preferred, while for high reliability requirements, water-soluble flux paired with SAC305 is favored.
Published: 2026-08-27
SMT soldering of thick copper boards is prone to cold solder joints and insufficient soldering due to their large heat capacity and delayed temperature rise. Solder paste activity matching and precise control of the reflow temperature profile are required to ensure solder joint reliability. The ramp-up rate in the preheating zone must be controlled between 0.5℃/s and 1.5℃/s, and the peak temperature must meet the component class limits specified in IPC-J-STD-020D. Otherwise, batch failures such as solder balls, tombstoning, and PCB delamination will occur.
Published: 2026-08-27
In the double-sided mounting process, the solder paste soldering reliability of the second reflow pass is highly dependent on printing accuracy, reflow profile matching, and component heat capacity coordination. Based on measured data from mass production lines, this paper explicitly specifies key parameters including a stencil thickness of 0.12mm, a squeegee pressure of 2.8kg, and a reflow peak temperature of 235℃±2℃, and points out that the risk of re-melting of already soldered components on the A side during the B-side reflow pass is concentrated on resistors and capacitors below 0603 and the bottom pads of QFN packages.
Published: 2026-08-27
Addressing the pain points of high manual soldering costs and high rework rates for multi-pin connectors, this summary focuses on optimizing the practical wire feeding methods for solder wire, and proposes 6 immediately implementable cost-reduction actions, covering key links such as soldering tip selection, flux dosage control, and solder feeding rhythm adjustment. A single action can reduce the manual time for a single solder joint by up to 32%, saving over 1400 hours of rework time annually.
Published: 2026-08-27Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.