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Here you can find knowledge about Soldering Auxiliary Materials, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
The solder for industrial control motherboards is specifically designed for high-reliability soldering of industrial control motherboard PCBA. It features excellent wettability, low void rate, and strong thermal cycle resistance, meeting the demands of harsh scenarios such as wide temperature range, long service life, and vibration resistance. It is a core material for ensuring the long-term stability of solder joints on industrial control motherboards.
Published: 2017-06-01During the BGA welding rework and ball mounting process, the molding stability of solder paste directly determines the ball mounting yield and subsequent reflow soldering reliability. Jiajinyuan solder paste demonstrates excellent anti-offset capability in 0.3mm pitch BGA ball mounting. The synergistic control of its thixotropic index and pre-reflow collapse amount keeps the center offset of the solder balls stably controlled within ±15μm.
Published: 2017-05-28The solder used in energy storage modules is extremely sensitive to voiding rate. Low-void solder paste can control the voiding rate of BGA solder joints within 5%, significantly improving the thermal fatigue life of electronic control boards under high-power cycling. Jiajinyuan JY-810A solder paste, with its stable thixotropy, low residue, and reflow wetting angle of less than 25°, has become a practical combination for BGA soldering of electronic control boards in the selection of solder materials for energy storage modules.
Published: 2017-04-04The solder joint cracking rate of FPC soldered flexible screen modules under repeated bending scenarios is significantly reduced. The key lies in optimizing the solder paste printing accuracy, matching the reflow soldering temperature profile to the thermal expansion characteristics of the FPC substrate, and strictly controlling the FPC mounting offset and Z-axis pressure. Jiajinyuan's actual measurement shows that the cracking rate after 200,000 bending cycles is less than 0.3%, which is far better than the industry's conventional level of 0.8%.
Published: 2017-02-14Jiajinyuan PCBA soldering materials are specifically designed for new energy battery management system BMS boards, photovoltaic inverter control boards, and industrial PLC main control boards. Its low-void-rate solder paste maintains a stable void area of less than 12% after reflow in 0.3mm fine-pitch QFN packages, which can be further reduced to 8.5% with a nitrogen atmosphere, meeting the stringent requirements of automotive-grade AEC-Q200 for solder joint reliability.
Published: 2016-12-27High-frequency PCB soldering is extremely sensitive to the halogen content and residue control of solder paste. Jiajinyuan halogen-free low-residue solder paste, by optimizing the rosin system and activator ratio, ensures wettability while reducing ionic contamination to below 0.25μg/cm2, significantly minimizing impedance fluctuations and phase shifts in high-frequency signal transmission.
Published: 2016-12-13
Cold solder joints caused by solder wire are a high-frequency root cause of failures on SMT production lines. They are neither a simple material defect nor a single process control failure, but rather the result of coupled mismatches among multiple variables, including solder wire activity, wire diameter tolerance, flux residue, soldering iron temperature, wire feed rhythm, and solder joint wetting time. Typical manifestations include a dull solder joint surface without metallic luster, a thrust test result below 50gf, and an internal void rate exceeding 15% visible under X-ray inspection.
Published: 2016-12-07Humidity control in the immersion silver board welding workshop is a key process measure to suppress silver layer migration. When the ambient relative humidity is higher than 60%RH for a long time, an electrolyte film is easily formed on the surface of the immersion silver board, which accelerates the electrochemical migration of silver ions between the pad and the edge of the solder mask. Actual measurements on the Jia Jinyuan production line show that stably controlling the humidity within the range of 40% to 55%RH can reduce the silver migration failure rate by 72%. Combined with nitrogen-protected reflow soldering and matching the activity level of the solder paste, it can significantly improve the long-term reliability of immersion silver board welding.
Published: 2016-11-22
Wave soldering bar selection must closely align with actual production line performance. Sn99.3Cu0.7 solder bars are low-cost with acceptable oxidation resistance, but have weak wetting force. Silver-containing alloys improve fluidity and solder joint strength, but significantly increase costs. The differences between the two are particularly prominent in high-temperature continuous operation, fine-pitch through-hole soldering, and lead-free compatibility. Engineers must comprehensively determine the applicable boundaries of SnCu solders based on board thickness, component density, and rework rate.
Published: 2016-10-30When manually soldering wiring harness terminals, using large-size solder wire of 1.6mm or above with a soldering iron temperature of 350℃±10℃ can achieve full-formed solder joints at one time without cold soldering, sharp tips or dry joints, significantly improving the electrical connection reliability of the wiring harness under vibration conditions. This process has been batch verified on multiple new energy vehicle high-voltage wiring harness production lines of JJY.
Published: 2016-10-29Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.