SMT Solder Paste Manufacturers.
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Here you can find knowledge about Soldering Auxiliary Materials, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
Automotive electronic solder must meet the long-term reliability requirements of vehicle-mounted circuit boards under high-temperature, high-humidity, and strong-vibration environments. Jiajinyuan automotive electronic solder adopts a low-silver lead-free formula, delivers stable wettability at a peak reflow temperature of 260℃, controls the IMC layer thickness within the range of 3.2～4.8μm, effectively suppresses solder joint crack propagation, has obtained AEC-Q200 certification, and is used in mass production on ADAS domain controller PCBA production lines.
Published: 2015-08-30Rework soldering is a critical process in PCBA repair that demands extremely high precision and thermal control. This paper focuses on the full process of desoldering and replacing chips such as BGA and QFN, covering hot air gun parameter setting, stencil aperture matching, solder paste selection, and key points of post-soldering X-ray inspection. All parameters are derived from measured data on the JJY production line, emphasizing the coordinated control of temperature curve gradients, nozzle vacuum values, and PCB delamination risks.
Published: 2015-07-12Fluctuations in the alloy composition of solder paste directly undermine its soldering stability, causing batch defects such as cold solder joints, bridging, and poor wetting. Especially in high-density placement scenarios like 0201 components and 0.4mm pitch QFN packages, even a ±0.05wt% deviation in the tin-silver-copper ratio of the alloy solder paste can lead to a drop of over 12% in post-reflow solder joint thrust. Therefore, continuous monitoring of solder paste quality is a critical line of defense to ensure the SMT first-pass yield.
Published: 2015-05-21Soldering of 01005 components is extremely sensitive to solder paste volume control, and the stencil thickness directly determines the solder paste printing volume. Jia Jinyuan's actual measurements show that a 0.1mm stencil can stably control the solder paste volume within the range of 120±15μm in 01005 component soldering. Excessive thickness easily leads to tombstoning and bridging, while insufficient thickness causes cold soldering and solder balls. Collaborative optimization combining aperture size and squeegee pressure is the key to production line implementation.
Published: 2015-04-21Manual soldering is a key process for repair soldering and rework on SMT production lines. Novices often cause defects such as cold solder joints and solder spikes due to improper temperature control, excessive solder joint dwell time, or incorrect selection of soldering tip types. Based on twenty years of practical experience on the Jiajinyuan production line, this paper focuses on pre-soldering preparation, soldering iron parameter setting, solder joint operation rhythm, and common defect attribution, directly addressing the core operational details that affect the first-pass yield.
Published: 2015-02-11When soldering precision sensor circuit boards with immersion silver boards, the excellent solder joint stability stems from the high density of the immersion silver layer, controllable interfacial reaction, and strong thermal cycle resistance. Jiajinyuan immersion silver boards have a measured thrust of over 85gf on 0.15mm fine-pitch BGA and 0.3mm pitch MEMS sensor pads, with an IMC thickness fluctuation of less than 0.12μm after reflow, significantly outperforming conventional OSP boards.
Published: 2015-01-17BGA soldering quality is highly dependent on the rheological properties and reflow behavior of solder paste. Low-void solder paste, by optimizing metal content, flux activity and particle distribution, significantly reduces solder joint void rate to below 3% in actual production lines, and has become a core material for improving BGA soldering first-pass yield and long-term reliability.
Published: 2014-12-05OSP board soldering is a critical process in SMT production lines that is highly prone to cold solder joints, poor wetting, and pad oxidation failures. It is necessary to optimize stencil aperture design, solder paste selection, reflow profile, and first-article verification process in response to the thermal sensitivity, thin-layer characteristics, and weak adhesion to the copper substrate of the OSP anti-oxidation protective film. Otherwise, even if the placement accuracy meets the standards, batch issues such as dull solder joints, insufficient solder climb height, or abnormal ICT test impedance will occur after reflow.
Published: 2014-11-10SMT defects are a high-frequency source of failures on production lines. Typical issues such as solder balls, voids, tombstoning, and bridging are directly related to printing accuracy, reflow profile, and component coplanarity. Jia Jinyuan production line data shows that 83% of SMT defects stem from solder paste volume deviation exceeding ±15% or improper matching between stencil apertures and PADs.
Published: 2014-09-14Wave soldering of thick-copper PCBs is prone to solder joint voids, poor wetting, and uneven heat absorption caused by copper thickness. Using Jiajinyuan high-wettability solder bars can significantly improve solder climb height and the consistency of fillet formation, with particularly pronounced process advantages in structures with copper thickness above 2oz, large-area copper foils, and multilayer thick-copper constructions.
Published: 2014-08-25Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.