SMT Solder Paste Manufacturers.
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The QFN soldering process requires precise control of solder paste volume, stencil aperture, and reflow profile. Actual measurements on Jia Jinyuan's production line show that a 0.12mm-thick stencil with 30μm trapezoidal apertures can effectively inhibit cold solder joints and bridging. Combined with reflow parameters of a peak temperature of 235℃±2℃ under nitrogen protection and a time above liquidus of 65 seconds, the first-pass yield of QFN soldering is stably maintained above 99.2%.
Published: 2010-06-17After multiple thawing cycles, solder paste viscosity exhibits nonlinear attenuation. After 3 thawing cycles, the viscosity decreases by approximately 28%, and after 5 cycles, the attenuation reaches 46%. Thawed solder paste is prone to causing solder skip, misalignment, and bridging in SMT production lines. Changes in solder paste viscosity directly affect squeegee pressure settings and the compatibility of stencil apertures.
Published: 2010-06-08The direct supply model from domestic factories for solder auxiliary materials significantly reduces intermediate costs. Jiajinyuan's full range of solder auxiliary materials, including solder paste, flux, and cleaning agents, supports orders starting from 100kg. The unit price for bulk purchases is 18% to 25% lower than that of traders, and the delivery cycle is shortened to within 7 working days, meeting the needs of high-frequency replenishment and urgent changeovers on SMT production lines.
Published: 2010-05-25
Solder paste stencil printing defects are a high-frequency failure in SMT production lines. Essentially, they occur when solder paste fails to transfer completely onto PCB pads. The root causes are often intertwined with stencil aperture accuracy, tension degradation, and the rheological properties of the solder paste. It is necessary to simultaneously inspect stencil wear status, squeegee pressure parameters, and changes in solder paste viscosity. Neglecting any of these aspects will lead to false yield fluctuations.
Published: 2010-05-16In the actual production line application of ISO solder materials, the melting point deviation between batches is controlled within ±1.2℃, and the fluctuation of active residue is less than 0.03%. This is attributed to Jia Jinyuan's decomposition of ISO 9001 clauses item by item into 27 executable actions, including smelting temperature recording frequency, alloy composition quick inspection response time, and packaging sealing sampling proportion, ensuring that each batch of ISO solder materials is fully controlled from feeding to outbound.
Published: 2010-04-26Cold solder joint is one of the most frequent soldering defects on SMT production lines. Its cause is often misjudged as insufficient solder paste activity, but in fact, it mostly stems from the deterioration of pad solderability combined with mismatched flux activity. By specifically improving the wetting ability of the pad surface, selecting JJY JY-602 medium-high activity no-clean flux, and strictly controlling the OSP film thickness and nitrogen purity, the cold solder joint rate can be reduced from 3.2‰ to below 0.4‰ without changing the reflow profile.
Published: 2010-04-22
Eco-friendly solder wire is not equivalent to RoHS compliance. It is necessary to confirm whether the content of six hazardous substances, including lead, mercury, and cadmium, is below the limit through a third-party test report. A supplier's verbal commitment or "lead-free" label alone cannot replace actual test data. Production lines often overlook batch differences, resulting in typical RoHS non-compliance symptoms such as dull solder joints and poor wetting after the entire batch of PCBs goes through the reflow oven.
Published: 2010-04-07Solder used in electronics manufacturing plants must achieve dynamic matching across all processes including SMT placement, wave soldering, and touch-up soldering. Jiajinyuan solder adapts to complex thermal stress scenarios with reflow peak temperature of 235℃, wave soldering temperature of 260℃, and manual touch-up soldering instantaneous temperature of 380℃ through melting point gradient design. Its active residue content is controlled within 0.012%, avoiding ICT test leakage and excessive ion contamination.
Published: 2010-03-28The wiping frequency of solder paste stencils directly affects the uniformity and profile clarity of printed solder paste. Excessive wiping accelerates stencil tension decay and causes insufficient solder paste deposition, while insufficient wiping easily leads to solder paste drying, aperture clogging, and induces typical defects such as solder bridging and insufficient solder. Therefore, to scientifically formulate solder paste control strategies, wiping frequency must be included as a key process parameter for dynamic calibration.
Published: 2010-03-19X-Ray inspection can penetrate BGA packages to directly observe solder ball morphology, void distribution, and bridging defects, making it an irreplaceable method for verifying the internal quality of reballing soldering after rework. Especially after reballing operations are completed on JJY rework stations, X-Ray inspection must be performed to confirm whether solder ball coplanarity, offset, and void rate comply with IPC-A-610 Class 2 standards.
Published: 2010-02-27Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.