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The stirring method of solder paste directly affects its viscosity stability and printing yield. Machine stirring accurately reproduces the process window through three parameters: rotation speed, time, and load. In contrast, manual stirring, with uncontrollable force, frequency, and direction, easily leads to high dispersion of solder paste viscosity. Actual measurements show that for solder paste from the same batch, the viscosity fluctuation range after machine stirring is controlled within ±150 Pa·s, while that after manual stirring can reach ±400 Pa·s. This difference is directly reflected in the stencil aperture filling rate and the incidence of solder joint bridging.
Published: 2021-11-13
Lead-containing and lead-free solder wires must not be mixed on the same production line. Due to the large difference in melting points, incompatible flux systems, and high risk of residue corrosion, mixing them will lead to cold solder joints, bridging, brittle solder joint cracking, and AOI misjudgment. The 217°C melting point of lead-free solder and the 183°C melting point of lead-containing solder wire create a thermal stress conflict, and their halogen contents and activation temperatures differ, which can easily cause batch soldering defects.
Published: 2021-11-12Solder OEM contract manufacturing foreign trade brand owners focus on the real needs of SMT production lines, providing one-stop solder OEM supply services from alloy ratio debugging and flux activity matching to reel/bottle custom packaging, supporting RoHS, REACH compliance certification and UL94 V-0 flame retardant rating verification. Jiajinyuan has completed rapid sampling and batch delivery for 37 export-oriented enterprises.
Published: 2021-11-07
Excessive wave soldering dross directly affects soldering yield and the consumption cost of solder bars. Common causes include high impurity content in solder bars, uncontrolled wave soldering temperature, severe carbonized flux residue, excessive stirring of the solder pot, and insufficient nitrogen protection. Solutions require coordinated efforts across multiple dimensions, including solder bar selection, temperature profile optimization, regular dross removal frequency, flux volatilization control, and nitrogen purity monitoring.
Published: 2021-10-21During the pin dip soldering process, by precisely controlling the dip soldering time, temperature and flux activity, the pin dip tin thickness can be effectively controlled between 0.03mm and 0.08mm, avoiding pin adhesion and bridging defects caused by an excessively thick tin layer. Measured data from the Jiajinyuan production line shows that after reducing the dip soldering time from 5 seconds to 3.2 seconds, the bridging rate decreased by 67%. This method has been batch-verified in the pre-treatment stage of DIP plug-in wave soldering.
Published: 2021-10-20Poor wetting of the bottom pad during QFN soldering often leads to cold solder joints or voids. By changing the stencil aperture from the conventional 1:1 to a 0.92:1 trapezoidal scaling design, JJY significantly improves the solder paste transfer rate without increasing the amount of solder. Combined with the coordinated control of squeegee pressure at 0.45 MPa and speed at 45 mm/s, the wetting area of the QFN soldering bottom pad is increased from 68% to 91%, and the measured solder joint void rate is below 12%.
Published: 2021-09-26To address the issue of warpage that easily occurs in thin PCB boards during solder paste soldering, this paper starts from the rheological properties, metal content, thixotropic index of solder paste and the volatilization behavior of flux, proposes a selection and process coordination scheme adapted to thin board solder paste, and emphasizes the practical effects of low-stress solder paste, medium-low temperature reflow window and fine-tuning of printing parameters on suppressing warpage.
Published: 2021-09-06If excessive flux remains after solder paste reflow soldering, especially between high-density PCBs or fine-pitch components, ionic contamination can easily form, leading to reduced insulation resistance, excessive leakage current, or even short-circuit failures. Although no-clean solder paste is nominally specified as not requiring cleaning, the active components of its flux residue, when coupled with moisture on the board surface, can still significantly degrade surface insulation performance.
Published: 2021-08-28Connector solder is specifically designed for welding various electronic connector terminals, featuring excellent wettability, low void rate, and strong thermal shock resistance. It is suitable for high-density connection scenarios such as FPC, board-to-board, and wire-to-board, and exhibits stable thrust and low cold solder joint rate in both reflow soldering and selective wave soldering processes, making it a critical solder material for ensuring the long-term insertion and removal reliability and signal integrity of connectors.
Published: 2021-08-28SMT stencils face frequent bridging and solder ball defects in fine-pitch IC printing. Micro-hole laser stencils significantly reduce short-circuit rates on devices with a pitch below 0.3mm by precisely controlling aperture size, wall roughness, and taper structure. Mass production verification by Jiajinyuan shows that bridging defects decreased by 62%, solder ball occurrence reduced by 78%, directly improving the first-pass yield.
Published: 2021-08-14Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.