SMT Solder Paste Manufacturers.
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Here you can find knowledge about Solder Quotation, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
Chinese-made solder exports to ASEAN must simultaneously meet the dual requirements of China's export supervision and the technical access of ASEAN importing countries, involving the application of RCEP rules of origin, SN/T 0370.3-2018 packaging inspection, HS code 81052090 classification confirmation, and adaptation to the RoHS exemption clauses of the destination country. A batch of Jiajinyuan solder wire was fully returned during inspection by a Vietnamese customer due to flux residue failing to meet the limits of TCVN 8264:2019, exposing the problem of missing third-party SGS testing before export.
Published: 2024-08-05SMT printing is a key process in which SMT stencils evenly transfer solder paste to PCB pads, directly affecting placement accuracy and reflow soldering yield. In actual production lines, solder paste viscosity, stencil aperture size, squeegee pressure, and printing speed must be coordinated and matched; any slight deviation will cause typical defects such as insufficient solder, solder bridging, or misalignment.
Published: 2024-07-28PCBA soldering materials have complete SGS certifications, covering all categories including lead-tin alloys, lead-free solder pastes, fluxes and cleaning agents, and comply with mandatory export standards such as IEC 61249, RoHS 2.0 and REACH. They can be directly used for complete machine exports to the EU, North America, Japan and South Korea, avoiding customs clearance delays or batch returns caused by missing material qualifications.
Published: 2024-07-14Tin whisker growth after solder paste reflow is a critical failure mode affecting solder paste reliability. Its root causes are closely related to the silver content, grain size, flux residue, and intermetallic compound growth kinetics in the solder paste formulation. By precisely regulating the Sn/Ag/Cu ratio in the solder paste formulation, adding trace inhibitory elements, and optimizing the thermal stability of the flux, the whisker initiation time can be significantly delayed.
Published: 2024-06-30Automotive electronic solder maintains the mechanical strength of solder joints within a wide temperature range of -40°C to 150°C, and shows no microcracks after random vibration tests at 20G acceleration and 10Hz–2kHz, meeting the dual requirements of temperature resistance and vibration resistance for automotive electronic solder in high-reliability scenarios such as ADAS controllers and BMS main control boards.
Published: 2024-06-29
Whether solder bars can be mixed depends on the compatibility of alloy compositions and the matching degree with the process window of the wave soldering machine. Mixing different alloy solders can easily lead to risks such as melting point shift, uneven wetting, and embrittlement of solder joints. In actual production lines, common phenomena include increased solder dross, solder joint spikes, or cold solder joints. It is recommended to give priority to using solder bars from the same manufacturer and the same batch to ensure the stability of the alloy solder composition and the consistency of soldering.
Published: 2024-06-27Cold soldering is the most hidden fatal defect in SMT production lines. Insufficient reflow peak temperature prevents the solder paste from fully melting and wetting the pads, resulting in cold solder joints and false soldering. Jia Jinyuan solder paste can only complete the eutectic reaction above 183°C, and its wetting force drops sharply when the temperature is below 205°C. Cold solder joints have a gray surface without metallic luster, and the thrust test value is more than 50% lower than the standard value.
Published: 2024-06-15Low-smoke solder wire for connector soldering is designed for high-volume automated soldering lines, addressing the pain points of traditional solder wires such as heavy smoke, excessive spatter, and poor wettability. It significantly reduces TVOC concentrations in the operation area while ensuring high electrical conductivity and mechanical strength. Compatible with automatic wire feeders for wire diameters ranging from 0.3 to 1.2 mm, it has achieved stable continuous feeding for 8 hours without downtime on customer production lines of Jiajinyuan.
Published: 2024-05-27Relying on its solder ODM R&D capabilities, JJY has developed customized new solder formulations with low residue, high wettability and narrow melting range for special soldering processes such as laser solder paste jetting, vacuum reflow and low-temperature thermocompression bonding. These formulations have been successfully adapted to scenarios including 01005 component micro-pads, Cu/Ni/Au plating and dissimilar metal bonding, significantly reducing void rate and the risk of excessive IMC growth.
Published: 2024-05-11Dip soldering is a key process that completes batch soldering by vertically immersing PCB pins into the surface of molten solder using a manual dip soldering machine or a wave soldering machine. Its core lies in the coordinated control of solder temperature, immersion depth, and dwell time. Jiajinyuan equipment has verified in actual production lines that a temperature control accuracy of ±2℃ and a standard dip soldering window of 0.8~1.2 seconds can effectively suppress defects such as cold solder joints and bridging.
Published: 2024-04-29Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.