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Excessive wave soldering dross directly affects soldering yield and the consumption cost of solder bars. Common causes include high impurity content in solder bars, uncontrolled wave soldering temperature, severe carbonized flux residue, excessive stirring of the solder pot, and insufficient nitrogen protection. Solutions require coordinated efforts across multiple dimensions, including solder bar selection, temperature profile optimization, regular dross removal frequency, flux volatilization control, and nitrogen purity monitoring.
Published: 2021-10-21During the pin dip soldering process, by precisely controlling the dip soldering time, temperature and flux activity, the pin dip tin thickness can be effectively controlled between 0.03mm and 0.08mm, avoiding pin adhesion and bridging defects caused by an excessively thick tin layer. Measured data from the Jiajinyuan production line shows that after reducing the dip soldering time from 5 seconds to 3.2 seconds, the bridging rate decreased by 67%. This method has been batch-verified in the pre-treatment stage of DIP plug-in wave soldering.
Published: 2021-10-20Poor wetting of the bottom pad during QFN soldering often leads to cold solder joints or voids. By changing the stencil aperture from the conventional 1:1 to a 0.92:1 trapezoidal scaling design, JJY significantly improves the solder paste transfer rate without increasing the amount of solder. Combined with the coordinated control of squeegee pressure at 0.45 MPa and speed at 45 mm/s, the wetting area of the QFN soldering bottom pad is increased from 68% to 91%, and the measured solder joint void rate is below 12%.
Published: 2021-09-26To address the issue of warpage that easily occurs in thin PCB boards during solder paste soldering, this paper starts from the rheological properties, metal content, thixotropic index of solder paste and the volatilization behavior of flux, proposes a selection and process coordination scheme adapted to thin board solder paste, and emphasizes the practical effects of low-stress solder paste, medium-low temperature reflow window and fine-tuning of printing parameters on suppressing warpage.
Published: 2021-09-06If excessive flux remains after solder paste reflow soldering, especially between high-density PCBs or fine-pitch components, ionic contamination can easily form, leading to reduced insulation resistance, excessive leakage current, or even short-circuit failures. Although no-clean solder paste is nominally specified as not requiring cleaning, the active components of its flux residue, when coupled with moisture on the board surface, can still significantly degrade surface insulation performance.
Published: 2021-08-28Connector solder is specifically designed for welding various electronic connector terminals, featuring excellent wettability, low void rate, and strong thermal shock resistance. It is suitable for high-density connection scenarios such as FPC, board-to-board, and wire-to-board, and exhibits stable thrust and low cold solder joint rate in both reflow soldering and selective wave soldering processes, making it a critical solder material for ensuring the long-term insertion and removal reliability and signal integrity of connectors.
Published: 2021-08-28SMT stencils face frequent bridging and solder ball defects in fine-pitch IC printing. Micro-hole laser stencils significantly reduce short-circuit rates on devices with a pitch below 0.3mm by precisely controlling aperture size, wall roughness, and taper structure. Mass production verification by Jiajinyuan shows that bridging defects decreased by 62%, solder ball occurrence reduced by 78%, directly improving the first-pass yield.
Published: 2021-08-14
The large amount of smoke generated by solder wire during welding mainly comes from thermal decomposition of flux, excessively high welding temperature, excessively high rosin content in the solder wire, or poor ventilation. These factors jointly increase the generation intensity and toxicity risk of welding fumes, which is particularly prominent in wave soldering and manual soldering iron operations.
Published: 2021-08-03
For BGA high-density packaging scenarios, Jiajinyuan's halogen-free, low-void solder paste 8M9P/5RR series has completed production line verification at leading packaging and testing customers. The measured void rate is stably controlled within 3%. After reflow soldering, the solder joints exhibit uniform wetting and a dense, continuous IMC layer, raising the first-pass yield of BGA devices from 92.7%
Published: 2021-07-14The control of the dwell time of the OSP board welding production line is directly related to the chemical stability and solderability of the OSP film layer. If the exposure time of the PCB from the spray OSP treatment to before reflow soldering exceeds 48 hours, or if it stays in a high-temperature and high-humidity environment (such as RH > 60%, T > 25°C) for more than 24 hours, the film layer is prone to hydrolysis and oxidation, which will cause the solder joint void rate to increase by more than 12% and the wetting angle to increase to more than 45°. Actual measurements on the Jiajinyuan production line show that this problem accounts for 67% of the solder bridging defects in OSP board welding.
Published: 2021-07-09Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.