SMT Solder Paste Manufacturers.
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To address the challenge of solder bead control in SMT mass production, we recommend multiple domestic solder pastes validated on production lines, covering scenarios such as high-activity QFN solder climbing, halogen-free automotive lighting, laser welding, and water washing. By optimizing the alloy powder type, halogen content, and rosin system synergy, the probability of solder bead formation is reduced, meeting the triple demands of solder bead control, SMT solder paste stability, and domestic solder paste substitution and upgrading.
Published: 2009-05-21Multiple factories have tested and confirmed that domestic solder paste performs stably in reflow soldering applications. The 8MQP/5RQ series achieves a solder climbing rate close to 100%, the 8MNTTP/5RNTT series has a halogen content as low as 100~200ppm, and the 8M9P/5RR series delivers 0ppm zero halogen and extremely low voidage. These products cover scenarios including QFN/DFN, automotive lighting, high-precision communications, and ultra-low temperature laser welding. Domestic SMT solder paste replacement now has full temperature range and full process adaptability.
Published: 2009-05-19Chip solder paste mounting places extremely high demands on the activity, wetting ability, halogen residue, and alloy powder particle size matching of the solder paste. Among domestic solder paste brands, the Jiajinyuan LFP series covers all scenarios from ultra-low temperature to high temperature. The 8MQP/5RQ achieves nearly 100% solder wetting for QFN packages. The 8M9P/5RR is halogen-free and meets the low void requirements for automotive lighting. The 8MNTTP/5RNTT, with its hundred-ppm level halogen content and 00507BN fine powder, meets the high-precision chip mounting requirements for smartphone fingerprint sensors, truly bringing chip solder paste selection back to practical production line effectiveness.
Published: 2009-05-17The selection of solder paste for power boards must balance solder climbing capability, void rate, and halogen residue. Domestic solder pastes such as the 8MQP/5RQ series achieve nearly 100% solder climbing on QFN/DFN devices, while the 8M9P/5RR series is halogen-free with an extremely low void rate. The T4-grade 0307 alloy powder used in SMT solder paste forms stably within the 240–260°C reflow window. Domestic solder pastes now cover application scenarios ranging from communication motherboards to automotive lighting.
Published: 2009-05-15In LED module production, the selection of domestic solder paste directly determines solder wetting rate, void rate and cleaning difficulty. Jiajinyuan 8MQP/5RQ series LED solder paste achieves nearly 100% solder wetting in QFN/DFN packages; the 8M9P/5RR series module solder paste is halogen-free with an extremely low void rate; the 8MA series balances the conventional pitch of lighting LEDs and residue transparency. Multiple domestic solder pastes have passed production line verification, becoming cost-effective alternatives to imported LED solder pastes.
Published: 2009-05-13Solder paste samples must closely align with actual production line requirements. Domestic solder pastes already have replacement capability in terms of QFN solder wetting rate, halogen control, void rate, and laser welding adaptability. The 8MQP/5RQ series achieves nearly 100% solder wetting, the 8M9P/5RR series delivers zero halogen and extremely low void rate, and the 5RLJ series is specifically optimized for jet valve dispensing. SMT solder paste selection should use process window matching, residue transparency, and post-soldering cleaning cost as hard indicators.
Published: 2009-05-11High-wettability solder paste directly determines solder climb rate and void control in the soldering of fine-pitch devices such as QFN/DFN. Domestic solder paste brand Jiajinyuan covers the full spectrum from no-clean ROL0 to water-washable ORH1. Its 8MQP/5RQ series achieves nearly 100% solder climb, while the 8M9P/5RR series has an extremely low void rate and is suitable for automotive lighting. The selection of SMT solder paste must match the coupling relationship among alloy melting point, flux activity, and cleaning process.
Published: 2009-05-09To address the common issue of solder collapse during the soldering of fine-pitch components such as 0.4mm pitch QFN and 0.3mm CSP, we recommend a range of field-tested anti-collapse solder pastes that cater to specific requirements including zero halogen, low voiding, and high solder climb. Among them, the 8MNTTP/5RNTT series achieves a solder climb rate of over 98% with transparent residue during reflow soldering on mobile phone motherboards, while the 8M9P/5RR series delivers a void rate of less than 3% on automotive LED lighting boards. All products use T4/T5 grade fine-pitch alloy powder and rosin-based flux vehicles, making them truly triple-positioned products that are anti-collapse solder pastes, fine-pitch solder pastes, and domestic solder pastes suitable for domestic production lines.
Published: 2009-05-07Continuous printing solder paste directly affects yield and line changeover efficiency in SMT production lines. Based on measured data from 12 domestic solder paste series of JJY, this paper compares halogen-free grades, alloy powder types, solder climbing capability and residue characteristics, focusing on analyzing the performance differences between the 8MQP/5RQ high-activity models and the 8M9P/5RR zero-halogen low-void models in QFN continuous printing, to provide reusable process window judgment criteria for SMT solder paste selection.
Published: 2009-05-05For high-volume SMT production lines, the quality stability of domestic solder paste directly determines the first pass yield and rework cost. The 8MQP/5RQ series achieves nearly 100% solder wetting rate for QFN packages, with both halogen indicators below 1500ppm; the 8M9P/5RR series is halogen-free with an extremely low void rate, making it suitable for high-heat scenarios such as automotive lighting. These mass-produced solder pastes have been validated at multiple leading EMS manufacturers for over 6 consecutive months with no batch-related failures. Solder paste selection for SMT must match the reflow profile window and device pad design. Domestic solder paste has evolved from being usable to being reliable.
Published: 2009-05-03Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.