SMT Solder Paste Manufacturers.
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Tin whisker growth after solder paste reflow is a critical failure mode affecting solder paste reliability. Its root causes are closely related to the silver content, grain size, flux residue, and intermetallic compound growth kinetics in the solder paste formulation. By precisely regulating the Sn/Ag/Cu ratio in the solder paste formulation, adding trace inhibitory elements, and optimizing the thermal stability of the flux, the whisker initiation time can be significantly delayed.
Published: 2024-06-30Automotive electronic solder maintains the mechanical strength of solder joints within a wide temperature range of -40°C to 150°C, and shows no microcracks after random vibration tests at 20G acceleration and 10Hz–2kHz, meeting the dual requirements of temperature resistance and vibration resistance for automotive electronic solder in high-reliability scenarios such as ADAS controllers and BMS main control boards.
Published: 2024-06-29
Whether solder bars can be mixed depends on the compatibility of alloy compositions and the matching degree with the process window of the wave soldering machine. Mixing different alloy solders can easily lead to risks such as melting point shift, uneven wetting, and embrittlement of solder joints. In actual production lines, common phenomena include increased solder dross, solder joint spikes, or cold solder joints. It is recommended to give priority to using solder bars from the same manufacturer and the same batch to ensure the stability of the alloy solder composition and the consistency of soldering.
Published: 2024-06-27Cold soldering is the most hidden fatal defect in SMT production lines. Insufficient reflow peak temperature prevents the solder paste from fully melting and wetting the pads, resulting in cold solder joints and false soldering. Jia Jinyuan solder paste can only complete the eutectic reaction above 183°C, and its wetting force drops sharply when the temperature is below 205°C. Cold solder joints have a gray surface without metallic luster, and the thrust test value is more than 50% lower than the standard value.
Published: 2024-06-15Low-smoke solder wire for connector soldering is designed for high-volume automated soldering lines, addressing the pain points of traditional solder wires such as heavy smoke, excessive spatter, and poor wettability. It significantly reduces TVOC concentrations in the operation area while ensuring high electrical conductivity and mechanical strength. Compatible with automatic wire feeders for wire diameters ranging from 0.3 to 1.2 mm, it has achieved stable continuous feeding for 8 hours without downtime on customer production lines of Jiajinyuan.
Published: 2024-05-27Relying on its solder ODM R&D capabilities, JJY has developed customized new solder formulations with low residue, high wettability and narrow melting range for special soldering processes such as laser solder paste jetting, vacuum reflow and low-temperature thermocompression bonding. These formulations have been successfully adapted to scenarios including 01005 component micro-pads, Cu/Ni/Au plating and dissimilar metal bonding, significantly reducing void rate and the risk of excessive IMC growth.
Published: 2024-05-11Dip soldering is a key process that completes batch soldering by vertically immersing PCB pins into the surface of molten solder using a manual dip soldering machine or a wave soldering machine. Its core lies in the coordinated control of solder temperature, immersion depth, and dwell time. Jiajinyuan equipment has verified in actual production lines that a temperature control accuracy of ±2℃ and a standard dip soldering window of 0.8~1.2 seconds can effectively suppress defects such as cold solder joints and bridging.
Published: 2024-04-29In formic acid atmosphere vacuum reflow soldering, solder paste must balance activity control and bubble removal; vacuum solder paste must have low vapor pressure, high thermal stability, and formic acid compatibility, while formic acid reflow solder paste requires a flux system that can synergistically reduce oxides with formic acid without exacerbating metal corrosion. These three factors jointly determine the void fraction and shear strength of solder joints in high-power devices.
Published: 2024-04-21For the first-article confirmation of the insufficient solder production line, the solder paste forming status must be visually inspected pad by pad, with a focus on identifying typical insufficient solder defects such as edge collapse, central depression, and local solder shortage. Simultaneous troubleshooting shall be conducted in combination with squeegee pressure, stencil aperture size, and solder paste rheological properties to ensure the printing stability of Jia Jinyuan solder paste under the low solder volume process window.
Published: 2024-04-17
Flux paste and solder paste have completely different functional roles in SMT placement soldering. Flux paste contains no metal powder and has no forming capability, so it cannot replace solder paste to achieve solder joint bonding and structural support. It can only serve as an auxiliary supplement to solder paste or a flux reinforcement method for local rework.
Published: 2024-04-09Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.