SMT Solder Paste Manufacturers.
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Pin dip soldering using tin bars for molten tin is an efficient process for high-volume component preprocessing. It achieves uniform tin plating on pin surfaces through constant-temperature bath control, pre-coating of flux, and vertical immersion, significantly improving subsequent SMT placement yield and reflow soldering wettability. Jiajinyuan tin bars exhibit stable fluidity and minimal dross in the 183°C–205°C range, meeting the continuous operation requirements of pre-wave soldering processes.
Published: 2025-04-20During the soldering rework of gold-plated boards, the gold layer is prone to oxidation by high temperatures or loss due to mechanical scraping, which leads to exposure of the nickel layer on the pad surface, poor wetting, and increased cold solder joints, directly affecting the long-term reliability of gold-plated board soldering. It is necessary to implement coordinated control from three aspects: soldering iron temperature, dwell time, and cleaning method.
Published: 2025-03-09Thick copper board welding must address three major challenges: large heat capacity, rapid heat dissipation, and difficult wetting caused by copper surface oxidation. During the SMT placement stage, the reflow peak temperature must be increased to 265℃±3℃ and the time above the liquidus line must be extended to over 90 seconds. For wave soldering, a combination of high-activity no-clean flux with a preheating temperature of 150℃, wave height of 10mm, and conveyor angle of 5° must be used. Otherwise, cold solder joints, excessive solder joint void rates, and pad peeling on thick copper PCBs are highly likely to occur.
Published: 2025-02-16Eutectic solder Sn63Pb37 solder wires and bars are the preferred material for reworking high-density devices such as BGA and QFN in the repair industry, thanks to their precise 183°C melting point, absence of pasty range, and excellent wettability. Jia Jinyuan's products of this model have demonstrated extremely low bridging rates and stable tensile strength values in actual production lines. With common diameter specifications ranging from 0.5mm to 1.2mm, they meet the dual requirements of manual soldering iron welding and hot air gun solder replenishment.
Published: 2025-02-02
The voids in solder joints formed by bar solder wave soldering are closely related to the material properties of the solder bar. Excessive impurity elements such as arsenic and antimony in high-purity lead-free solder bars will significantly aggravate void formation, while an imbalanced tin-copper alloy ratio or fluctuations in silver content directly affect the surface tension and wetting behavior in the molten state, thereby altering the gas escape paths inside the solder joint.
Published: 2025-01-19Medical electronic equipment has extremely stringent requirements for the purity, ionic residue and long-term reliability of solder materials. With its strictly controlled metal composition, low halogen content and batch stability, ISO solder materials have become the first choice for SMT production lines of implantable and monitoring devices. Jiajinyuan ISO solder materials have passed the biocompatibility pre-assessment of IEC 60601-1 Appendix A. In actual production lines, the ionic residue on the board surface after reflow is <0.85μg/cm2, and the copper mirror corrosion test shows no discoloration for over 72 hours.
Published: 2025-01-15
In 2024, solder paste suppliers accelerated intelligent R&D, promoted the deep integration of online inspection and process parameter optimization technologies, improved manufacturing efficiency and product quality, and injected new impetus into the electronics manufacturing industry.
Published: 2025-01-08Bridge formation is one of the most frequent soldering defects on SMT production lines. Low solder paste viscosity leads to aggravated slump after printing, while overly large stencil apertures directly expand the excess solder volume margin. The combination of the two makes it extremely easy to form solder bridges between adjacent pads. For the commonly used 8800 series solder paste from JJY, when its viscosity at 25℃ falls below 140 Pa·s and the aperture area exceeds the pad by more than 15%, the incidence of bridge formation rises significantly.
Published: 2025-01-01Nitrogen reflow significantly suppresses the oxidation reaction between metal powder and flux in solder paste during the high-temperature phase by reducing the oxygen concentration in the furnace to below 100 ppm, thereby improving the wetting ability of solder on PCB pads and component pins. It is particularly effective in addressing poor wetting issues on OSP surface-finished boards and fine-pitch QFN packages, and is a process optimization method validated as effective on JJY's production line.
Published: 2024-12-11
The occurrence of solder balling during the reflow soldering process is not necessarily a quality issue with the solder paste itself; it is more often related to the coupling of multiple factors such as printing parameters, stencil design, temperature zone settings, and ambient humidity. Especially when the solder paste is unevenly heated during the reflow stage or the solvent volatilizes insufficiently, splashing-type solder balls are highly likely to be induced. Therefore, troubleshooting should start from the storage conditions of the solder paste, the matching of the reflow soldering profile, and the coordination of the PCB pad layout.
Published: 2024-12-02Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.