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Solder paste slump is a typical defect after SMT printing where the edges of the solder paste spread outwards and its height decreases, resulting in solder joint bridging or cold solder joints. Its causes cover multiple factors such as solder paste rheological properties, stencil design, ambient temperature and humidity, and squeegee parameters. To prevent solder paste slump, it is necessary to start with solder paste selection, tightening the printing process window, optimizing stencil apertures, and real-time control of workshop temperature and humidity.
Published: 2015-04-17To address the failure risk of moisture-absorbed solder paste in the high-humidity environment of the solder paste workshop, this solution starts from three aspects: dynamic temperature and humidity monitoring, solder paste protection process reengineering, and shelf-life control after opening. It specifies 25℃/60%RH as the critical threshold, stipulates that solder paste must be used up within 4 hours after opening, and emphasizes the key role of coordinated adjustment of nitrogen-protected storage and squeegee pressure in reducing printing defects caused by moisture-absorbed solder paste.
Published: 2015-03-07
The cost difference between halogen-free solder paste and ordinary solder paste is concentrated in three aspects: raw materials, certification, and process adaptation. Halogen-free solder removes halogen elements such as bromine and chlorine, which leads to the reconstruction of the rosin system and increases the complexity of the flux formula by more than 30%. Coupled with certification costs such as REACH and IEC 61249-2-21, the per-kilogram purchase price is generally 28% to 45% higher than that of ordinary solder paste. However, reduced cleaning frequency, lower nitrogen consumption, and decreased rework rate during production line switching can partially offset this premium.
Published: 2015-02-22To address the persistent issues of solder paste and solder powder splashing and frequent tiny solder beads around small components on SMT production lines, this solution adopts a five-dimensional coordinated approach covering solder paste selection, stencil aperture design, squeegee parameters, printing pressure, and reflow soldering temperature profile. By adjusting solder paste viscosity and metal content to match the mounting requirements of 0201/01005-level components, and precisely controlling the peak reflow temperature of the solder paste within the range of 235±2℃, the measured solder bead defect rate has been reduced from 3200ppm to below 170ppm.
Published: 2015-02-16Manual soldering is a key process for repair soldering and rework on SMT production lines. Novices often cause defects such as cold solder joints and solder spikes due to improper temperature control, excessive solder joint dwell time, or incorrect selection of soldering tip types. Based on twenty years of practical experience on the Jiajinyuan production line, this paper focuses on pre-soldering preparation, soldering iron parameter setting, solder joint operation rhythm, and common defect attribution, directly addressing the core operational details that affect the first-pass yield.
Published: 2015-02-11When soldering precision sensor circuit boards with immersion silver boards, the excellent solder joint stability stems from the high density of the immersion silver layer, controllable interfacial reaction, and strong thermal cycle resistance. Jiajinyuan immersion silver boards have a measured thrust of over 85gf on 0.15mm fine-pitch BGA and 0.3mm pitch MEMS sensor pads, with an IMC thickness fluctuation of less than 0.12μm after reflow, significantly outperforming conventional OSP boards.
Published: 2015-01-17
The Jiajinyuan R&D team has been continuously optimizing the formulation system in response to solder performance bottlenecks, and has developed 12 major halogen-free and lead-free solder series covering the full temperature range of high, medium, low and ultra-low temperatures. Its domestic high-end solders have achieved breakthroughs in key indicators such as QFN/DFN solder wetting rate, low void rate for automotive lamps, and no solder balls in laser welding.
Published: 2015-01-08
The design of solder paste stencil aperture openings directly affects the release performance of stencil printing and the forming quality of solder paste. Undersized apertures lead to insufficient solder paste volume and edge tearing, while oversized apertures easily cause bridging and slumping. Moreover, the aperture shape, wall roughness, and taper design alter the contact area and separation stress between the solder paste and the stencil. These factors are often overlooked in actual production lines, yet they directly determine the first-pass yield and SPI yield.
Published: 2014-12-18BGA soldering quality is highly dependent on the rheological properties and reflow behavior of solder paste. Low-void solder paste, by optimizing metal content, flux activity and particle distribution, significantly reduces solder joint void rate to below 3% in actual production lines, and has become a core material for improving BGA soldering first-pass yield and long-term reliability.
Published: 2014-12-05Solder manufacturers can provide OEM/ODM customized solder formula specifications to meet actual production line needs such as high reliability, lead-free soldering, and low-temperature soldering. As a solder manufacturer with 20 years of focus on SMT placement soldering, JJY has completed full-link customization for over 300 customers, covering alloy composition design, flux activity matching, and packaging forms, and supports fine-tuning verification of more than ten basic systems ranging from Sn96.5Ag3.0Cu0.5 to Sn42Bi58.
Published: 2014-11-24Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.