SMT Solder Paste Manufacturers.
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The use of T5/T6 ultra-fine solder paste in the ball mounting process can significantly improve the consistency of solder ball formation and edge retention, addressing issues such as easy edge collapse, poor sphericity, and height dispersion commonly associated with traditional solder pastes. It is particularly suitable for micro-pitch BGA ball mounting below 0.3mm and high-density packaging scenarios.
Published: 2015-12-17Excessively high peak reflow temperature of solder paste will directly lead to excessive growth of intermetallic compounds in solder paste joints, intensified dissolution of pad copper, and thermal damage to component bodies. In actual production lines, common defects include cold solder joints, solder balls, tombstoning, and PCB delamination. This problem mostly stems from inaccurate temperature profile settings, drift of furnace temperature sensors, or uncalibrated differences in activity between different batches of solder paste.
Published: 2015-12-10Solder OEM contract manufacturing embeds the ISO 9001 quality management system throughout the entire process, covering incoming raw material inspection, melting parameter monitoring, wire drawing tension calibration, and packaging environment temperature and humidity recording. It achieves a melting point deviation of ≤±1.2℃ for each solder batch, controls the fluctuation of rosin residue within the range of 0.35% to 0.42%, ensures no downtime during material changeover on SMT production lines and zero adjustment of reflow profiles, and truly supports batch stability in solder OEM contract manufacturing delivery.
Published: 2015-11-29RoHS solder is a mandatory access threshold for the export of foreign trade electronic products. Jia Jinyuan RoHS solder has passed all SGS tests, with lead content <100ppm, cadmium <50ppm, and hexavalent chromium <1000ppm, fully meeting the requirements of the EU RoHS 2.0 Directive and the US CPSIA. It has completed full-process verification of solder paste printing, reflow soldering, and AOI inspection on the production lines of 37 OEM factories in Shenzhen, Dongguan, Suzhou and other places.
Published: 2015-11-12
The acid value of solder paste directly affects solder wettability and residual corrosion risk. Acidic solder paste is suitable for difficult-to-solder metals but requires strict control of the cleaning process, while neutral solder paste is mostly used for high-reliability PCBs and no-clean scenarios. Selection must be comprehensively determined based on the oxidation degree of the substrate, the material of component pins, the reflow temperature window, and the production line's cleaning capability.
Published: 2015-11-01Domestic solder has achieved full-process controllability from material formulation to batch stability, supports customers in small-batch sample trial and prototyping, and is widely adapted to scenarios such as new energy vehicle BMS modules, high-reliability PCBA for medical monitors, and consumer fast-charging boards. It can maintain 4-hour printing stability under workshop temperature control of 25℃~30℃. The thixotropic index of Jia Jinyuan solder paste reaches 0.72, with a viscosity recovery rate ≤15%, fully meeting the fine printing requirements of 0201 components and 0.3mm pitch QFN.
Published: 2015-10-22
Prolonged high-temperature operation of solder bars in a wave soldering furnace can indeed cause micro-segregation of alloy components. Particularly when tin-lead or lead-free solder bars are continuously exposed to temperatures above 260°C with insufficient bath surface agitation, elements such as lead, silver, and copper may locally enrich due to differences in density and oxidation rate. However, within the standard 8-hour solder replacement cycle, compositional variations remain well below the tolerances permitted by IPC-J-STD-006. What truly affects soldering stability is often the accumulation of dross and carbonized flux residues.
Published: 2015-10-14High-frequency board welding imposes extremely high requirements on the thermal sensitivity of the substrate. Materials such as PTFE and ceramic-filled PP generally have a glass transition temperature below 170°C. If the peak reflow temperature exceeds 260°C, it can easily cause delamination, blistering, or dielectric constant drift. Actual measurements on Jiajinyuan's production line show that 255°C is the safe threshold for most high-frequency board welding. Thermal damage must be avoided through stepwise heating, reducing residence time in the high-temperature zone, and nitrogen atmosphere control.
Published: 2015-10-08Pre-tinning OSP pads places extremely high demands on the wettability of solder paste. Low-residue, highly active, and highly penetrating OSP solder paste must be selected; otherwise, cold solder joints, tombstoning, and poor wetting are likely to occur. In actual production lines, common problems mostly stem from insufficient reaction between the solder paste and the OSP coating, failure of the flux to break through the coating in time during reflow, or printing misalignment caused by a mismatch between the metal content and viscosity of the solder paste.
Published: 2015-09-13The no-clean and water-washable formulations for PCBA soldering materials need to balance ionic residue control and post-soldering surface cleanliness. The Jiajinyuan series formulations achieve stable performance with rosin-based residue <0.5μg/cm2 and halogen content <0.1wt% in actual production lines, meeting the process requirements for high-density PCBA soldering materials for 01005 components and 0.3mm pitch BGA.
Published: 2015-09-05Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.