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Here you can find knowledge about Solder Ball Reduction, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
When excessive voids occur in SMT soldering, simultaneously investigate the solder paste metal content, flux volatilization curve, and actual temperature deviations in each reflow oven zone. Focus on verifying whether the preheat ramp exceeds 2°C/s, whether the peak temperature is below 235°C or above 245°C, and whether the time above liquidus is less than 60 seconds or exceeds 90 seconds.
Published: 2026-08-27
After solder paste is returned to room temperature, solder balls and spattering are likely to occur. The main causes are uneven volatilization of flux due to temperature difference, aggravated oxidation of metal powder, and sudden viscosity change. Standardized operation requires strict control of temperature, standing, stirring, and management of the time limit after opening, to avoid repeated freezing and thawing and excessive exposure time.
Published: 2026-08-26
The flux residue of LFP-5RW1 series water-washable lead-free solder paste can be removed by water washing, providing high cleanliness, and is suitable for high-reliability electronic assembly.
Published: 2026-08-24
The LFP-5RTS series halogen-free and lead-free high-temperature solder paste is suitable for high-temperature reflow soldering processes, and delivers excellent soldering stability and environmental performance.
Published: 2026-08-24
The LFP-5RNTT series halogen-free and lead-free high-temperature solder paste is renowned for its low residue, high reliability, and environmental compliance, making it a preferred soldering material in the electronics manufacturing industry.
Published: 2026-08-24
Tight global tin ore supply is driving the development of the solder recycling and reuse industry, and the proportion of secondary tin in solder raw materials is steadily increasing.
Published: 2026-08-24
The expansion of 5G base station construction scale has driven the application demand for lead-free solders, bringing new growth to high-reliability welding materials.
Published: 2026-08-24
Jiajinyuan LFP-5RQ series halogen-free and lead-free high-temperature solder paste adopts a low-halogen formula, with transparent soldering residues, helping electronic manufacturing enterprises meet the environmental control requirements of RoHS and REACH.
Published: 2026-08-24
The China-US trade friction has intensified price fluctuations in solder raw materials, and the volatile prices of key metals such as tin and silver have affected cost control for solder manufacturers.
Published: 2026-08-24
The SMT solder industry is accelerating its intelligent transformation, with Industry 4.0 technologies improving solder production consistency and quality control levels.
Published: 2026-08-24Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.