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Here you can find knowledge about Repair Solder Wire, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
In BGA chip repair, the synergistic use of solder paste and flux paste directly affects ball mounting yield and soldering reliability. In actual production lines, the flux paste application amount and solder paste printing thickness must be dynamically adjusted based on chip size, solder ball diameter, and PCB pad oxidation level, to avoid pad corrosion caused by excessive activity or increased voids caused by insufficient activity.
Published: 2013-10-12Poor wetting of oxidized old pads during rework soldering is a high-frequency production line failure. Jia Jinyuan JY-808 high-activity flux can effectively reduce the CuO layer and lower surface tension. Combined with precise temperature-controlled soldering tip operation in a 350°C nitrogen environment, it increases the spread rate of solder paste on oxidized copper pads from less than 40% to over 92%, significantly shortening the rework cycle and reducing missed detection of cold solder joints.
Published: 2012-07-22In repair prototyping scenarios, syringe solder paste selection must balance solder wetting performance, residue transparency, and equipment compatibility. Among domestic solder pastes, the Jiajinyuan 8MQP/5RQ series achieves nearly 100% solder wetting on QFN/DFN devices, while the 8MNTTP/5RNTT series contains only 100~200ppm of halogens with transparent residues, making it particularly suitable for high-precision repair solder paste needs such as mobile phones and Bluetooth devices.
Published: 2009-04-27Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.