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Here you can find knowledge about Manual Soldering, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
Dip soldering is a key process that completes batch soldering by vertically immersing PCB pins into the surface of molten solder using a manual dip soldering machine or a wave soldering machine. Its core lies in the coordinated control of solder temperature, immersion depth, and dwell time. Jiajinyuan equipment has verified in actual production lines that a temperature control accuracy of ±2℃ and a standard dip soldering window of 0.8~1.2 seconds can effectively suppress defects such as cold solder joints and bridging.
Published: 2024-04-29During dip soldering, temperature runaway in manual dip soldering pots is the main cause of cold solder joints and missed solder joints. For the JiajinYuan manual dip soldering pot, the solder bath temperature must be stably controlled at 255℃±3℃, the preheating zone maintained at 90℃~110℃, and the dip soldering time strictly limited to 3 seconds±0.5 seconds. Imbalance in the coordination of these three factors will cause bridging or poor wetting.
Published: 2023-06-14Manual soldering is an irreplaceable key process in circuit board repair and rework. Especially during BGA rework, 0201 component touch-up soldering, and operations in heat-sensitive areas of multilayer boards, the coordinated matching of soldering iron temperature, solder wire activity, and solder paste rheological properties directly determines solder joint reliability. Jiajinyuan solder paste stands out in low-temperature wettability, residue insulation, and reflow stability. When used with constant-temperature soldering irons and micro-diameter soldering tips, it can significantly reduce the risk of thermal damage.
Published: 2022-09-05The stirring method of solder paste directly affects its viscosity stability and printing yield. Machine stirring accurately reproduces the process window through three parameters: rotation speed, time, and load. In contrast, manual stirring, with uncontrollable force, frequency, and direction, easily leads to high dispersion of solder paste viscosity. Actual measurements show that for solder paste from the same batch, the viscosity fluctuation range after machine stirring is controlled within ±150 Pa·s, while that after manual stirring can reach ±400 Pa·s. This difference is directly reflected in the stencil aperture filling rate and the incidence of solder joint bridging.
Published: 2021-11-13When manually soldering and repairing old PCBs, oxidized solder pads cause poor tinning and frequent cold solder joints. High-activity solder wire significantly improves the first-pass soldering success rate through stronger oxide film penetration and lower wetting temperature, and is especially suitable for manual soldering rework scenarios of communication boards and industrial control motherboards in service for over 8 years.
Published: 2021-06-22Manual rework with eutectic solder offers a wide temperature window, fast wetting, and low voiding rate in actual production line operations. When paired with a constant-temperature soldering iron and a preheating platform, the peak temperature can be stably controlled at 183℃±5℃, significantly reducing the risks of BGA cold solder joints and PCB delamination, making it especially suitable for rapid-response scenarios involving small batches and multiple product varieties.
Published: 2021-06-08When manually soldering mobile phone motherboards, thin-diameter solder wire can precisely cover pads below 0.3mm, avoiding bridging and cold solder joints. Combined with a constant-temperature soldering iron and a high-magnification microscope, it enables reliable connections of tiny solder joints such as peripheral resistors and capacitors around BGA and cable interfaces, making it an indispensable practical process for rework production lines to handle high-density PCBs.
Published: 2018-12-11When manually soldering wiring harness terminals, using large-size solder wire of 1.6mm or above with a soldering iron temperature of 350℃±10℃ can achieve full-formed solder joints at one time without cold soldering, sharp tips or dry joints, significantly improving the electrical connection reliability of the wiring harness under vibration conditions. This process has been batch verified on multiple new energy vehicle high-voltage wiring harness production lines of JJY.
Published: 2016-10-29Manual soldering is a key process for repair soldering and rework on SMT production lines. Novices often cause defects such as cold solder joints and solder spikes due to improper temperature control, excessive solder joint dwell time, or incorrect selection of soldering tip types. Based on twenty years of practical experience on the Jiajinyuan production line, this paper focuses on pre-soldering preparation, soldering iron parameter setting, solder joint operation rhythm, and common defect attribution, directly addressing the core operational details that affect the first-pass yield.
Published: 2015-02-11Domestic solder covers wire diameters from 0.3mm to 3.0mm, all temperature ranges (183℃~227℃) for both leaded and lead-free variants, and three flux systems: rosin, no-clean, and water-washable. It is compatible with multiple scenarios including high-speed SMT printing, wave soldering, dip soldering, and manual touch-up soldering. The Jiajinyuan series has a measured wetting angle ≤35°, bridging rate below 0.08%, and residual ion content <0.5μg/cm2. No adjustment to stencil apertures or reflow temperature profile is required when switching materials on the production line.
Published: 2011-03-06Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.