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Supply from domestic factories for consumer electronics solder has achieved stable batch delivery. Jiajinyuan solder meets first-tier production line requirements in terms of Sn-Ag-Cu series alloy composition control, oxide layer suppression process, and batch consistency. Under the same specifications, its quotation is 18% to 22% lower than that of imported brands, and it supports weekly rolling production scheduling and 48-hour emergency shipment, significantly alleviating the risk of line changeover downtime caused by solder supply disruption on SMT production lines.
Published: 2019-09-08
In 2018, a trend of solder paste formula optimization emerged in the electronics manufacturing industry, and enterprises began to pay attention to the application scenarios of environmentally friendly and low-residue solder pastes. With increasingly strict environmental regulations and rising industry demand for high-precision manufacturing, solder paste technology is gradually developing in the direction of low harmful substances and high stability.
Published: 2019-01-01The solder used in energy storage modules is extremely sensitive to voiding rate. Low-void solder paste can control the voiding rate of BGA solder joints within 5%, significantly improving the thermal fatigue life of electronic control boards under high-power cycling. Jiajinyuan JY-810A solder paste, with its stable thixotropy, low residue, and reflow wetting angle of less than 25°, has become a practical combination for BGA soldering of electronic control boards in the selection of solder materials for energy storage modules.
Published: 2017-04-04To address the issue of solder joint cracking caused by concentrated thermal stress in energy storage new energy electronic control boards during frequent charge-discharge cycles, solder paste with high ductility, low elastic modulus, and excellent thermal cycle life must be selected. New energy solder paste must pass thermal shock verification at -40℃ to 125℃ for more than 1000 cycles, while reliability solder paste emphasizes the uniformity of the IMC layer and the stability of the Cu6Sn5 phase. The metal content, particle size distribution, and flux residue ion concentration of the solder paste jointly determine its long-term thermal fatigue resistance.
Published: 2016-07-02RoHS solder is a mandatory access threshold for the export of foreign trade electronic products. Jia Jinyuan RoHS solder has passed all SGS tests, with lead content <100ppm, cadmium <50ppm, and hexavalent chromium <1000ppm, fully meeting the requirements of the EU RoHS 2.0 Directive and the US CPSIA. It has completed full-process verification of solder paste printing, reflow soldering, and AOI inspection on the production lines of 37 OEM factories in Shenzhen, Dongguan, Suzhou and other places.
Published: 2015-11-12Domestic solder has achieved full-process controllability from material formulation to batch stability, supports customers in small-batch sample trial and prototyping, and is widely adapted to scenarios such as new energy vehicle BMS modules, high-reliability PCBA for medical monitors, and consumer fast-charging boards. It can maintain 4-hour printing stability under workshop temperature control of 25℃~30℃. The thixotropic index of Jia Jinyuan solder paste reaches 0.72, with a viscosity recovery rate ≤15%, fully meeting the fine printing requirements of 0201 components and 0.3mm pitch QFN.
Published: 2015-10-22Automotive electronic solder must meet the long-term reliability requirements of vehicle-mounted circuit boards under high-temperature, high-humidity, and strong-vibration environments. Jiajinyuan automotive electronic solder adopts a low-silver lead-free formula, delivers stable wettability at a peak reflow temperature of 260℃, controls the IMC layer thickness within the range of 3.2~4.8μm, effectively suppresses solder joint crack propagation, has obtained AEC-Q200 certification, and is used in mass production on ADAS domain controller PCBA production lines.
Published: 2015-08-30Consumer electronics solder faces the dual challenges of solder bead residue and high solder joint void rate in SMT production lines. Jiajinyuan low-solder-bead low-void consumer electronics solder optimizes the metal powder particle size distribution and flux activity ratio, reducing the number of post-soldering solder beads for 0201 components to ≤3 per square centimeter and stably controlling the BGA solder joint void rate at ≤8%, significantly improving the first-pass yield of consumer electronics solder on high-density PCBs.
Published: 2014-03-19Lead-free and halogen-free solder options for electronics manufacturing have become mainstream. Jiajinyuan provides dual-system lead-free solders: Sn96.5Ag3.0Cu0.5 and Sn99.3Cu0.7, while also supporting halogen-free formulations with Br < 900 ppm and Cl < 900 ppm, meeting the full requirements of IEC 61249-2-21, JPCA-ES-01-2021, and RoHS3, and adapting to different product standards for consumer electronics, automotive electronics, and medical devices.
Published: 2013-08-12
Common failures of soldering consumables in electronics factories directly hit production line pain points, covering solder paste printing misalignment, collapse, oxidation and skinning, solder wire soldering spatter, icicle formation, poor wetting, insufficient activity of soldering paste and whitening residue, etc. Combined with 20 years of SMT practical experience, immediately executable parameter adjustment and material control solutions are provided.
Published: 2012-04-18Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.