SMT Solder Paste Manufacturers.
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Low-residue solder paste and no-clean solder paste are becoming key choices for cost reduction and efficiency improvement in high-density PCBA production lines. Domestic solder paste has already demonstrated the capability to replace imported alternatives in terms of halogen control, solder climbing performance, and thermal stability. The Jiajinyuan 8MNTTP/5RNTT series achieves ultra-low halogen levels of 100~200ppm with transparent residue, while the 8M9P/5RR series reaches 0ppm zero halogen with extremely low voidage, making it suitable for high thermal reliability scenarios such as automotive lighting.
Published: 2009-04-15Domestic solder paste that resists oxidation and maintains long-term stability once opened is designed for high-frequency lid opening and intermittent printing scenarios on SMT production lines. It adopts a ROL0 zero-halogen rosin-based formula and a T4/T5 fine powder alloy system, significantly improving the shelf life and printing lifespan of antioxidant solder paste series such as 8MQP/5RQ and 8MNTTP/5RNTT. It achieves nearly 100% solder wetting rate for QFN packages while ensuring clear post-reflow residue, making it a high-reliability choice for replacing imported SMT solder paste and reducing oxidation risks of domestic solder paste.
Published: 2009-04-13Solder paste samples must be selected based on actual production line requirements. Domestic solder pastes already have the capability to replace imported ones in terms of QFN solder climbing rate, halogen control, and adaptability to special processes. SMT solder paste selection should prioritize matching device packaging, reflow window, and cleaning requirements. For example, the 8MQP/5RQ series achieves nearly 100% solder climbing for high-density QFNs, while the 8M9P/5RR is suitable for low-void sensitive scenarios such as automotive lighting.
Published: 2009-04-11When planning to replace solder paste on the production line, it is necessary to balance solder wetting rate, void rate, residue transparency, and equipment compatibility. Based on frontline SMT process verification, this paper sorts out 16 domestically produced solder paste models that have been applied in mass production, covering typical scenarios such as high solder wetting for QFN/DFN, low voids for automotive lighting, laser dispensing, stainless steel/aluminum welding, and ultra-low temperature applications. It focuses on recommending SMT solder pastes such as 8MQP/5RQ, 8M9P/5RR, and 8MNTTP/5RNTT, providing directly actionable selection criteria for domestic solder paste replacement.
Published: 2009-04-09Solder paste selection for SMT factories must match production line equipment, component packages, and reliability requirements. Among domestic solder pastes, the Jiajinyuan series covers hard requirements such as over 90% solder wetting for QFN, low voids in automotive lamps, and no solder balls for laser dispensing. SMT solder paste parameters such as 0307T4 alloy with a melting point of 221–227°C, ROL0 halogen <500ppm, and translucent rosin residue have been batch-verified on mobile phone motherboards and communication modules.
Published: 2009-04-07To address production-line pain points in new energy circuit board soldering, such as poor solder climbing, high voiding rate, and excessive halogen residue, this paper draws on 20 years of frontline SMT experience to recommend multiple domestic solder pastes suitable for QFN/DFN packages, automotive lighting, and high-precision communication modules, covering niche scenarios including zero-halogen, water-washable, laser-specific, and ultra-low-temperature formulations. It focuses on analyzing the real process performance of the 8MQP/5RQ, 8M9P/5RR, and 8MW5/5RW5 series in meeting the three core demands for new energy solder paste, PCB solder paste, and domestic solder paste.
Published: 2009-04-05Consumer electronics SMT production has stringent requirements for solder paste's wetting rate, residue transparency, halogen content and thermal stability. Domestic solder paste has achieved full-scenario coverage from QFN/DFN high-density packaging to precision terminals such as mobile phones, tablets and Bluetooth devices. The 8MQP/5RQ series has a wetting rate close to 100%, the 8MNTTP/5RNTT series has halogen content as low as 100~200ppm, and the 8M9P/5RR series is halogen-free with extremely low void rate, truly supporting the process confidence for the domestic substitution of consumer electronics solder paste and SMT solder paste.
Published: 2009-04-03Based on 20 years of practical experience in SMT production lines, this article provides an in-depth analysis of the application scenarios and process performance of 12 mainstream domestic solder pastes, covering key metrics such as QNP solder fillet formation rate, void control, residue transparency, and water wash compatibility. It focuses on comparing the real-world performance of models including 8MQP/5RQ, 8M9P/5RR, and 8MNTTP/5RNTT in high-demand scenarios such as communication equipment, automotive lighting, and fingerprint locks, providing actionable solder paste evaluation basis for SMT solder paste selection.
Published: 2009-04-01The practical performance of high-activity solder paste in achieving nearly 100% solder wetting rate for fine-pitch QFN/DFN devices directly determines the success or failure of domestic solder paste brand selection. Based on the measured data of Jia Jinyuan LFP-JJY series halogen-free and lead-free high-temperature solder paste, this paper compares the differences in residue transparency, halogen content, and alloy powder particle size distribution among models including 8MQP/5RQ, 8MTSP/5RTS, and 8MNTTP/5RNTT in the reflow soldering solder paste process, providing a directly applicable domestic solder paste replacement solution for SMT production lines.
Published: 2009-03-30Poor solder wetting on pads often stems from insufficient solder paste activity, unreasonable alloy powder particle size distribution, or halogen residue inhibiting wetting. This domestic solder paste, through the synergistic optimization of 0307/305 alloy powder T4 fineness, ROL0 ultra-low halogen (<500ppm) and rosin-based carrier, significantly improves the QFN/DFN solder climbing rate to 70%–90%, and is a cost-effective solution to replace imported SMT solder paste and achieve stable mass production of solder paste with good solderability.
Published: 2009-03-28Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.