SMT Solder Paste Manufacturers.
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Here you can find knowledge about Complete Soldering Accessories, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
The SMT solder paste operation process covers five major stages: thawing, stirring, printing, component placement, and reflow soldering. The core of cost reduction across the entire process lies in reducing solder paste waste, extending stencil life, lowering the rework rate, and optimizing equipment energy consumption. Based on real production line data, this paper proposes 8 actionable measures covering four dimensions: personnel operation, parameter setting, auxiliary material management, and equipment maintenance.
Published: 2026-08-27
The selection of SMT soldering materials must match the specific process path. The activity, melting point, metal content, particle size distribution, and flux type of solder paste, solder wire, solder filament, and solder bar directly affect printing accuracy, reflow forming, and the reliability of manual repair soldering. For example, lead-free solder paste commonly uses the Sn96.5Ag3.0Cu0.5 composition, has a particle size D50 of 25±5μm, and its viscosity is controlled at 700±150Pa·s, while solder wire for manual soldering needs to match the soldering iron temperature of 320℃～350℃ and the heat capacity characteristics of the pads.
Published: 2026-08-27
What are the more common problems that may occur after the production of tin wire (i.e., the finishe
Published: 2026-05-12
If you find that the edges of the solder paste are uneven, there are burrs or stains on the surface
Published: 2026-05-12RoHS solder fully meets the requirements of EU environmental directives. Jiajinyuan lead-free solder paste achieves stable printing of 0.3mm fine-pitch QFN on SMT production lines, with a wetting angle of less than 35° after reflow and a void rate of less than 15%. When paired with solder wires and bars of the same system, it can ensure consistent process windows for wave soldering and manual soldering, avoiding poor wetting or abnormal thickening of the IMC layer caused by mixed use.
Published: 2024-09-16PCBA soldering materials have complete SGS certifications, covering all categories including lead-tin alloys, lead-free solder pastes, fluxes and cleaning agents, and comply with mandatory export standards such as IEC 61249, RoHS 2.0 and REACH. They can be directly used for complete machine exports to the EU, North America, Japan and South Korea, avoiding customs clearance delays or batch returns caused by missing material qualifications.
Published: 2024-07-14Dip soldering is a key process that completes batch soldering by vertically immersing PCB pins into the surface of molten solder using a manual dip soldering machine or a wave soldering machine. Its core lies in the coordinated control of solder temperature, immersion depth, and dwell time. Jiajinyuan equipment has verified in actual production lines that a temperature control accuracy of ±2℃ and a standard dip soldering window of 0.8~1.2 seconds can effectively suppress defects such as cold solder joints and bridging.
Published: 2024-04-29
For BGA high-density packaging scenarios, Jiajinyuan's halogen-free, low-void solder paste 8M9P/5RR series has completed production line verification at leading packaging and testing customers. The measured void rate is stably controlled within 3%. After reflow soldering, the solder joints exhibit uniform wetting and a dense, continuous IMC layer, raising the first-pass yield of BGA devices from 92.7%
Published: 2021-07-14PCBA soldering materials cover a full range of auxiliary materials including solder paste, solder wire, flux, cleaning agent and nitrogen. Their selection and control directly determine the SMT placement first-pass yield and long-term reliability. The Jiajinyuan series performs stably under stringent parameters such as reflow soldering peak temperature of 235℃±5℃, solder paste viscosity of 700±100Pa·s, and flux solid content of 18.5%.
Published: 2021-04-07When delivering foreign trade orders, solder manufacturers must provide complete inspection documents simultaneously, including SGS reports, RoHS/REACH compliance certificates, measured melting point and wettability data, batch shipment inspection records, and packaging and transportation temperature and humidity monitoring records. These documents directly determine customer customs clearance efficiency and production line first-pass yield. Jia Jinyuan solder manufacturer has embedded standardized inspection documents into its ERP delivery process.
Published: 2019-10-04Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.