Active Solder Wire for Oxidized Boards, Strong Tinning Circuit Board Repair Solder Wire

Improving Pad Solderability for Cold Solder Joints: Solving the Issue with Properly Matched Active Flux

Cold solder joint is one of the most frequent soldering defects on SMT production lines. Its cause is often misjudged as insufficient solder paste activity, but in fact, it mostly stems from the deterioration of pad solderability combined with mismatched flux activity. By specifically improving the wetting ability of the pad surface, selecting JJY JY-602 medium-high activity no-clean flux, and strictly controlling the OSP film thickness and nitrogen purity, the cold solder joint rate can be reduced from 3.2‰ to below 0.4‰ without changing the reflow profile.