Low-temperature tin wire is a type of Solder Wire. Solder wire is mainly composed of two components. One type is called Eutectic Soldering tin. What are the differences in composition between 63% tin and 37% lead solder wires? JJY is here to share them with you.

  Solder wire has a melting point of 183℃. If the tin content exceeds 63%, its compressive strength gradually decreases as the melting temperature rises. Conversely, when the tin content is below 10%, the compressive strength during soldering is poor, and the joint quickly becomes brittle.

  Eutectic solder remains in a good state below the wetting range of the Soldering Material. At the eutectic temperature, however, the solder changes directly from solid to liquid, without passing through a semi-liquid state.

  When melting, the temperature of eutectic solder is slightly lower than that of non-eutectic solder, which reduces thermal damage to the components being soldered. In addition, because eutectic solder changes from liquid to solid very quickly, the occurrence of empty solder joints is greatly reduced.

  In most cases, solder raw materials fluctuating around 227℃ will not show a significant difference in the melting point of the solder wire. Therefore, when using solder wire, you should first test the temperature that the components can withstand, and then choose a solder wire with an appropriate melting point or a low-temperature solder wire.

  At present, commonly used solder wires can be roughly classified into two categories — Leaded solder wire and lead-free solder wire. They differ in main parameters such as melting point, as with low-temperature solder wire. If you want to learn more about low-temperature tin wire, Shenzhen JJY will guide you. Welcome to contact us.