The actual performance of the 8MQP/5RQ series halogen-free and lead-free high-temperature Solder Paste has been verified on the production line. Its 0307 alloy powder with T4 particle size paired with rosin-based Flux achieves nearly 100% wetting coverage on QFN 0.4mm pitch devices at a peak temperature of 245°C, while conventional medium-temperature solder paste often causes cold solder joints or bridging due to insufficient wetting on such fine-pitch packages. The total halogen content of this series is controlled within 1500ppm and complies with the ROL1 standard, which not only meets export compliance requirements but also avoids CAF failure caused by ionic residue after cleaning.

The 8M9P/5RR series is a zero-halogen REACH-certified high-temperature solder paste, especially suitable for heat sink soldering of automotive-grade LED headlight modules. Its 305 alloy powder maintains good rheological stability after holding in the 250°C zone for 45 seconds, with a measured solder joint void rate lower than 1.8%, far better than the 3.2% average of comparable imported brands under the same nitrogen concentration (100ppm O₂). This is attributed to the optimized compounding ratio of activators in its rosin matrix, which ensures oxide film removal capability while suppressing excessive corrosion.

For high power density scenarios such as communication base station PA modules, the 8MNTTP/5RNTT series was selected. It uses 00507B2N alloy powder with trace nickel addition, achieving a solder joint shear strength of 32.7N/mm² at a peak temperature of 255°C, a 9% improvement over conventional 0307. Meanwhile, the residue light transmittance is >92%, fully meeting the imaging clarity requirements of AOI optical inspection for bottom solder joints, and its ultra-low halogen content of 100~200ppm also eliminates the risk of pad corrosion caused by Cl⁻ precipitation after long-term high-temperature aging.

When the 5RLJ series was introduced to the laser welding production line, it was found that its T6 ultra-fine powder (D50=3.8μm) highly matches the laser beam energy absorption characteristics. After screw valve dispensing and instantaneous heating by a 15W fiber laser (heating rate >120°C/s), the solder joints have no spatter, no solder balls, and the IMC layer thickness is uniformly controlled at 1.2~1.5μm. Compared with the local over-melting phenomenon of ordinary T4 powder under the same parameters, it shows that the powder sphericity and surface oxide film control of this high-temperature solder paste have indeed achieved mass-production-level consistency.

The water-washable 8MW1P/5RW1 series has been proven in batch applications on lighting driver boards: all flux residue can be removed by circulating cleaning with pure water at 50°C for 60 seconds, with conductivity <1.2μS/cm. Its 0307 alloy powder achieves a solder joint microhardness of 18.3HV after reflow at 240°C, 27% higher than Sn64Bi35Ag1 medium-temperature solder paste under the same conditions, which explains why it can maintain a solder joint cracking rate lower than 0.015% during repeated thermal cycling of aluminum substrate LED modules.