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Here you can find knowledge about Solid Solder Wire, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
In SMT manual rework soldering scenarios, the choice between rosin-core solder wire and solid-core solder wire must be closely tied to solder joint quality, operational efficiency, and rework risk. Rosin-core solder wire is suitable for rapid rework soldering of small-batch, high-density, low-heat-capacity components, while solid-core solder wire is more appropriate for large pads, high-heat-capacity components, and military or medical PCBA sensitive to residues. The two have essential differences in terms of flux activity, thermal response, cleanability, and cost.
Published: 2026-08-27
Whether solder paste solidifies and fails during low-temperature storage depends on its formulation system and storage conditions. Common rosin-based solder paste tends to stratify or increase in viscosity below 5°C, but this does not mean complete failure. Its printing performance can be restored as long as it is returned to a constant temperature of 25°C for more than 4 hours and fully stirred. The key to solder paste storage is to avoid repeated freeze-thaw cycles and moisture intrusion.
Published: 2022-02-18Eutectic solder has a fixed single melting point in SMT production lines, enabling simultaneous melting and solidification, which significantly reduces thermal stress and void rate. Under the Sn96.5Ag3.0Cu0.5 system, the measured melting point of Jia Jinyuan eutectic solder is stable at 217.5℃±0.3℃, suitable for reflow soldering process control of high-density packages such as BGA and QFN.
Published: 2013-10-28Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.